Izinto Ezisiza Zokukhiqiza ze-SMT Kweminye Imibandela Evamile

Enqubweni yokukhiqiza yokubeka i-SMT, ngokuvamile kuyadingeka ukusebenzisa i-SMD yokunamathisela, i-solder paste, i-stencil nezinye izinto ezisizayo, lezi zinto ezisizayo ohlelweni lokukhiqiza umhlangano wonke we-SMT, ikhwalithi yomkhiqizo, ukusebenza kahle kokukhiqiza kudlala indima ebalulekile.

1. Isikhathi sesitoreji (Impilo yeshelufu)

Ngaphansi kwezimo ezishiwo, okokusebenza noma umkhiqizo usengakwazi ukuhlangabezana nezidingo zobuchwepheshe futhi ulondoloze ukusebenza okufanele kwesikhathi sokulondoloza.

2. Isikhathi sokubeka (Isikhathi sokusebenza)

I-Chip Adhesive, i-solder paste esetshenziswayo ngaphambi kokuchayeka endaweni eshiwo isengakwazi ukugcina amakhemikhali ashiwo kanye nezinto ezibonakalayo zesikhathi eside kakhulu.

3. I-Viscosity (I-Viscosity)

I-Chip Adhesive, i-solder inamathisela ekuconseni kwemvelo kwezinto zokunamathela zokulibaziseka kokuwa.

4. Thixotropy (Thixotropy Ratio)

I-Chip Adhesive kanye ne-solder paste inezici zoketshezi lapho ikhishwa ngaphansi kwengcindezi, futhi ngokushesha ibe ipulasitiki eqinile ngemva kokukhishwa noma ukuyeka ukufaka ingcindezi.Lesi sici sibizwa ngokuthi i-thixotropy.

5. Ukuqothuka (Ukuqothuka)

Ngemva kokunyatheliswa kwe-iphrinta ye-stencilngenxa yamandla adonsela phansi kanye nokushuba kwesimo sezulu kanye nokukhuphuka kwezinga lokushisa noma isikhathi sokupaka side kakhulu nezinye izizathu ezibangelwa ukuncishiswa kobude, indawo engezansi ngaphezu komngcele oshiwo wesenzakalo sokuwohloka.

6. Ukusabalalisa

Ibanga okunamathelayo okusakazeka kulo ekamelweni lokushisa ngemva kokukhipha.

7. Ukunamathela (I-Tack)

Ubukhulu bokunamathela kokunamathisela kwe-solder ezingxenyeni kanye nokuguqulwa kokunamathela kwayo ngokushintsha isikhathi sokugcina ngemuva kokuphrinta ukunamathisela kwe-solder.

8. Ukuchama (Ukuchama)

I-solder encibilikisiwe endaweni yethusi ukwenza isimo esifanayo, esibushelelezi futhi esinganqamuki songqimba oluncane lwe-solder.

9. No-clean Solder Paste (No-clean Solder Paste)

I-solder paste equkethe kuphela umkhondo wezinsalela ze-solder ezingenabungozi ngemva kokuhlanganisa ngaphandle kokuhlanza i-PCB.

10. I-Low Temperature Solder Paste (I-Low Temperature Namathisela)

I-solder inamathisele ngezinga lokushisa elincibilikayo elingaphansi kuka-163 ℃.