Ulwazi oluyisisekelo lwe-SMT
1. I-Surface Mount Technology-SMT (Surface Mount Technology)
Yini i-SMT:
Ngokuvamile kubhekiselwa ekusetshenzisweni kwemishini yokuhlanganisa ezenzakalelayo ukuze kunamathiselwe ngokuqondile kanye nohlobo lwe-solder chip kanye nezingxenye/amadivayisi ahlangene angenawo umthofu amancane noma amafushane (okubizwa ngokuthi i-SMC/SMD, evame ukubizwa ngokuthi izingxenye ze-chip) phezu kwebhodi lesifunda eliphrintiwe. (PCB) Noma obunye ubuchwepheshe bokuhlanganisa i-elekthronikhi endaweni eshiwo ngaphezulu kwe-substrate, eyaziwa nangokuthi ubuchwepheshe bokukhweza phezulu noma ubuchwepheshe bokukhweza phezulu, okubizwa nge-SMT (Surface Mount Technology).
I-SMT (Surface Mount Technology) ubuchwepheshe bezimboni obusafufusa embonini yezogesi.Ukunyuka nokuthuthuka kwayo ngokushesha kuwuguquko embonini yokuhlanganisa izinto zikagesi.Yaziwa ngele-"Rising Star" yemboni yezogesi.Kwenza ukuhlangana kwe-elekthronikhi kuyanda Uma kushesha futhi kulula, ukushintshwa kwemikhiqizo ehlukahlukene ye-elekthronikhi ngokushesha futhi ngokushesha, izinga lokuhlanganisa likhuphuka, kanye nentengo eshibhile, kube negalelo elikhulu ekuthuthukisweni okusheshayo kwe-IT ( Imboni yezoLwazi lwezoLwazi).
Ubuchwepheshe be-Surface Mount buthuthukiswa kusukela kubuchwepheshe bokukhiqiza bezingxenye zesekhethi.Kusukela ngo-1957 kuze kube manje, ukuthuthukiswa kwe-SMT kudlule izigaba ezintathu:
Isigaba sokuqala (1970-1975): Umgomo oyinhloko wezobuchwepheshe ukusebenzisa izingxenye ze-chip ezincane ekukhiqizeni nasekukhiqizeni ugesi oyingxubevange (okuthiwa amasekhethi amafilimu aminyene e-China).Kusukela kulo mbono, i-SMT ibaluleke kakhulu ekuhlanganisweni Inqubo yokukhiqiza kanye nokuthuthukiswa kobuchwepheshe bamasekhethi kube negalelo elikhulu;ngesikhathi esifanayo, i-SMT isiqalile ukusetshenziswa kakhulu emikhiqizweni yabantu njengamawashi e-quartz kagesi kanye nezibali zikagesi.
Isigaba sesibili (1976-1985): ukukhuthaza i-miniaturization esheshayo kanye nokusebenza okuningi kwemikhiqizo ye-elekthronikhi, futhi yaqala ukusetshenziswa kabanzi emikhiqizweni efana namakhamera wevidiyo, imisakazo ye-headset namakhamera kagesi;ngesikhathi esifanayo, inani elikhulu lemishini ezenzakalelayo yokuhlangana kwendawo yakhiwe Ngemva kokuthuthukiswa, ubuchwepheshe bokufaka kanye nezinto zokusekela zezingxenye ze-chip nazo sezivuthiwe, zabeka isisekelo sokuthuthukiswa okukhulu kwe-SMT.
Isigaba sesithathu (1986-manje): Umgomo oyinhloko ukunciphisa izindleko nokuthuthukisa ngokwengeziwe isilinganiso sentengo yokusebenza kwemikhiqizo ye-elekthronikhi.Ngokuvuthwa kobuchwepheshe be-SMT kanye nokuthuthukiswa kokuthembeka kwenqubo, imikhiqizo ye-elekthronikhi esetshenziswa ezempi kanye nokutshalwa kwezimali (imishini yemishini yokuxhumana yekhompyutha yezimoto) ithuthuke ngokushesha.Ngesikhathi esifanayo, inani elikhulu lemishini yokuhlanganisa ezenzakalelayo nezindlela zenqubo ziye zavela ukuze zenze izingxenye ze-chip Ukukhula okusheshayo kokusetshenziswa kwe-PCB kusheshise ukwehla kwenani eliphelele lezindleko zemikhiqizo ye-elekthronikhi.
2. Izici ze-SMT:
①Ukuminyana okuphezulu, usayizi omncane nesisindo esincane semikhiqizo ye-elekthronikhi.Ivolumu nesisindo sezingxenye ze-SMD cishe yi-1/10 kuphela yezingxenye ze-plug-in zendabuko.Ngokuvamile, ngemva kokwamukelwa kwe-SMT, ivolumu yemikhiqizo ye-elekthronikhi iyancipha ngo-40% ~ 60% futhi isisindo sincishiswa ngo-60%.~80%.
②Ukuthembeka okuphezulu, ikhono eliqinile lokunqanda ukudlidliza, nezinga eliphansi lokulimala kwamalunga e-solder.
③Izici ezinhle zefrikhwensi ephezulu, ezinciphisa ukuphazamiseka kwefrikhwensi kagesi kanye nomsakazo.
④ Kulula ukubona okuzenzakalelayo nokuthuthukisa ukusebenza kahle kokukhiqiza.
⑤Londoloza okokusebenza, amandla, okokusebenza, abasebenzi, isikhathi, njll.
3. Ukuhlukaniswa kwezindlela zokukhweza phezulu: Ngokwezinqubo ezihlukene ze-SMT, i-SMT ihlukaniswe yaba yinqubo yokusabalalisa (i-wave soldering) kanye nenqubo yokunamathisela i-solder (i-reflow soldering).
Umehluko wabo omkhulu yilezi:
①Inqubo ngaphambi kokuchibiyela ihlukile.Owokuqala usebenzisa i-patch glue kanti owokugcina usebenzisa i-solder paste.
②Inqubo ngemva kokuchibiyela ihlukile.Owokuqala udlula kuhhavini ogelezayo ukuze uphulukise ingcina futhi unamathisele izingxenye ebhodini le-PCB.I-Wave soldering iyadingeka;eyokugcina idlula kuhhavini lokugeleza kabusha ukuze i-soldering.
4. Ngokwenqubo ye-SMT, ingahlukaniswa ngezinhlobo ezilandelayo: inqubo yokukhweza ehlangothini olulodwa, inqubo yokukhweza ezinhlangothi zombili, inqubo yokupakisha exubile ezinhlangothi zombili.
①Hlanganisa usebenzisa izinto zokukhweza ngaphezulu kuphela
A. Ukuhlanganiswa okunohlangothi olulodwa olunokukhwezwa kwendawo kuphela (inqubo yokukhweza ehlangothini olulodwa) Inqubo: unamathisela i-solder ephrinta isikrini → izingxenye zokukhweza → ukuphinda kufakwe i-solder
B. Ukuhlanganisa okunezinhlangothi ezimbili okunokugxunyekwa kwendawo kuphela (inqubo yokukhweza ezinhlangothini ezimbili) Inqubo: unamathelisa i-solder ephrinta isikrini → izingxenye ezikhwezayo → i-reflow soldering → uhlangothi oluhlehlayo → ukunamathisela i-solder yokuphrinta isikrini → izingxenye ezikhwezayo → ukusoda kabusha
②Hlangana nezinto zokukhweza ngaphezulu kolunye uhlangothi kanye nengxube yezinto zokukhweza ngaphezulu kanye nezingxenye ezinezimbobo ngakolunye uhlangothi (inqubo yokuhlanganisa ehlangene emaceleni amabili)
Inqubo 1: Ukunamathisela i-solder ephrinta isikrini (uhlangothi olungaphezulu) → izingxenye ezikhwezwayo → ukuphinda kufakwe i-solder → uhlangothi oluhlehlayo → ukukhiphela (uhlangothi olungezansi) → izingxenye ezikhwezayo → ukushisa okuphezulu kokwelapha → uhlangothi oluhlehlayo → izingxenye ezifakwe ngesandla → i-wave soldering
Inqubo 2: Isikrini sokuphrinta se-solder sinamathiselwe (uhlangothi olungaphezulu) → izingxenye ezikhwezayo → ukuphinda kufakwe i-solder → i-plug-in yomshini (uhlangothi oluphezulu) → uhlangothi oluhlehlayo → olukhiphayo (uhlangothi olungezansi) → isichibi → ukuphulukiswa kwezinga lokushisa eliphezulu → ukusoda kwegagasi
③Ingaphezulu lisebenzisa izingxenye ezinembobo kanti indawo engezansi isebenzisa izinto zokukhweza ngaphezulu (inqubo yokuhlanganisa ehlangene emaceleni amabili)
Inqubo 1: Ukukhipha → izingxenye ezifakwayo → ukushisa okuphezulu → uhlangothi oluhlehlayo → izingxenye ezifaka isandla → i-wave soldering
Inqubo 2: I-plug-in yomshini → uhlangothi oluhlehlayo → ukusabalalisa → isichibi → ukuphulukiswa kwezinga lokushisa eliphezulu → i-wave soldering
Inqubo ethize
1. Ukugeleza kwenqubo yokuhlanganisa indawo ehlangene yohlangothi olulodwa Faka i-solder unamathisele ukuze ukhweze izingxenye kanye nokuphinda kufakwe i-solder
2. Ukugeleza kwenqubo yokuhlanganisa indawo enezinhlangothi ezimbili Uhlangothi lusebenzisa ukunamathisela kwe-solder ukukhweza izingxenye kanye ne-reflow soldering flap Uhlangothi lwe-B lusebenzisa unamathisele we-solder ukukhweza izingxenye kanye nokuphinda kufakwe i-solder.
3. Ukuhlanganiswa okuxubile okunohlangothi olulodwa (i-SMD ne-THC zisohlangothini olufanayo) Uhlangothi lusebenzisa ukunamathisela kwe-solder ukukhweza i-SMD reflow soldering Uhlangothi oluhlanganisa i-THC B ohlangothini lwe-wave soldering
4. Ukuhlanganiswa okuxubile okunohlangothi olulodwa (i-SMD ne-THC kuzinhlangothi zombili ze-PCB) Faka i-SMD enamathelayo ohlangothini luka-B ukuze ukhweze i-SMD enamathelayo yokuphulukisa i-flap A eceleni faka i-THC B eseceleni ye-wave solder
5. Ukukhweza okuxubile okunezinhlangothi ezimbili (i-THC isehlangothini A, izinhlangothi zombili u-A no-B zine-SMD) Faka unamathisele we-solder ohlangothini A ukuze ukhweze i-SMD bese ugeleza ibhodi eliphenduphendukayo elingu-B ohlangothini sebenzisa ingcina ye-SMD ukuze ukhweze i-SMD glue curing flip board A. ohlangothini ukufaka i-THC B Surface wave soldering
6. Ukuhlanganiswa okuhlangene okunezinhlangothi ezimbili (i-SMD ne-THC ezinhlangothini zombili zika-A no-B) Uhlangothi sebenzisa unamathisele we-solder ukuze ukhweze i-SMD reflow soldering flap B ohlangothini faka i-SMD glue ukukhweza i-SMD glue yokuphulukisa iflephu A faka uhlangothi lwe-THC B lwe-wave soldering B- side manual manual
Ezinhlanu.Ulwazi lwengxenye ye-SMT
Izinhlobo zengxenye ye-SMT esetshenziswa kakhulu:
1. Izinqamuleli zokukhweza ezingaphezulu kanye nama-potentiometers: izinto eziphikisana ne-chip engunxande, izihluthulelo ezingaguquki ezingamacylindrical, amanethiwekhi amancane aqinile aqinile, ama-chip potentiometers.
2. Ama-Surface Mount capacitor: ama-multilayer chip Ceramic capacitor, i-tantalum electrolytic capacitor, i-aluminium electrolytic capacitor, ama-mica capacitor
3. Ama-inductors okukhweza okungaphezulu: ama-chip inductors anenxeba, ama-chip inductors amaningi
4. Ubuhlalu kazibuthe: I-Chip Bead, i-Multilayer Chip Bead
5. Ezinye izingxenye ze-chip: i-chip multilayer varistor, i-chip thermistor, isihlungi se-chip surface wave, isihlungi se-chip multilayer LC, umugqa wokulibaziseka we-chip multilayer
6. Amadivayisi we-semiconductor we-Surface Mount semiconductor: ama-diode, ama-transistors apakishwe uhlaka oluncane, amasekethe amancane ahlanganisiwe ahlanganisiwe we-SOP, amasekhethi epulasitiki aholayo adidiyelwe i-PLCC, iphakheji ye-quad flat QFP, isithwali se-ceramic chip, iphakheji ye-sango eyindilinga ye-BGA, i-CSP (Iphakheji ye-Chip Scale)
I-NeoDen ihlinzeka ngezixazululo ezigcwele zomugqa womhlangano we-SMT, okuhlanganisa i-oven reflow ye-SMT, umshini wokugcwalisa igagasi, umshini wokukhetha nendawo, iphrinta yokunamathisela i-solder, isilayishi se-PCB, isilayishi se-PCB, isikhuthazi se-chip, umshini we-SMT AOI, umshini we-SMT SPI, umshini we-SMT X-Ray, Imishini yomugqa we-SMT, Izisetshenziswa zokukhiqiza ze-PCB Izingxenye eziyisipele ze-SMT, njll.
Isikhathi sokuthumela: Jul-23-2020