Izindlela Eziyisithupha ze-SMT Patch Component Disassembly(II)

IV.Indlela yokudonsa okuholayo
Le ndlela ifaneleka ukuhlakazwa kwe-chip - ama-circuits ahlanganisiwe afakwe.Sebenzisa intambo enoqweqwe oluqinile lokujiya okufanele, ngamandla athile, ngegebe elingaphakathi lephinikhodi yesekethe ehlanganisiwe.Ingxenye eyodwa yocingo olunamele ilungiswa endaweni kanti enye ibanjwe ngesandla.Lapho i-solder ephinikhodi yesifunda esihlanganisiwe iyancibilika.Donsa intambo ene-enameled ukuze "usike" i-solder joint futhi izikhonkwane ze-IC zihlukaniswe ku-PCB.
 
V. Indlela yokufanisa i-air gun soldering iron
Lungisa izinga lokushisa lesibhamu somoya libe ngaphezu kwama-degree angu-500, ivolumu yomoya emaphakathi, ukushisa okuqhubekayo kwamapheshana amabili ethayela, i-solder ichitheka ngokuphelele ngemva kwemizuzwana engaphezu kweshumi, ukususa kalula ngama-tweezers akhomba, kodwa le ndlela ilula. ukuze kuthinte isifunda esizungezile, ukusebenza ngokucophelela.Okulandelayo ngokuya ngedivayisi entsha, okokuqala ngamanzi e-rosin besmear kuntambo ye-solder, noma sebenzisa impushana ye-rosin ehlakazekile ku-bonding pad, ene-welding steel-toed heat weld plate ehlanzekile yomthofu, ukukhanya okumanzi okuholayo, i-lead tin akucaci kahle, lapho ushisela intambo yokushisisa yekhanda, zama ukuya ngasemngceleni, yenza ithini lomthofu elisele ku-welding plate peripheral.Sebenzisa ithuluzi elincane ukuhlanza imfucumfucu ye-rosin ku-pad lead.Thatha ucezu lwe-IC entsha, ngosizo lwe-rosin ukuthayela ku-IC pin, iphinikhodi emanzi ukukhanya ngaphandle kwe-burr, i-IC ikwi-desktop, cindezela ngomunwe, yenza IC pin up iqhude elincane, faka IC are welding plate , enephini elicijile elicijile IC indawo ephakathi nendawo, amehlo angewona amaqabane amahle angabuka ingilazi yokukhulisa, Ngemva kokubeka insimbi yokushisela ecijile ingase isetshenziselwe ukushisisa ithini emaphethelweni e-pad, ikhanda lensimbi elithambile liphushela iphinikhodi ye-IC ngaphakathi. ngemva kokuba ithini liyancibilika, ukuze iphini libe i-Engeli elungile kuphedi.Kudingeka ukushisela ama-engeli amane ane-diagonal kuqala, uphumule ngemva kokushisela, bese ushisela ezinye izinyawo.Ngemuva kwakho konke ukushisela, ingilazi yokukhulisa ingasetshenziswa ukubuka, kanti ithini elincane lingasetshenziswa ezindaweni ezimbi.

VI.Indlela yokususa i-tin absorber
Kunezinhlobo ezimbili ze-soldering iron kanye ne-tin absorber.Lapho kusetshenziswa i-tin absorber evamile, induku ye-piston ye-tin absorber icindezelwa phansi.Lapho i-solder joint of the electric soldering iron iyancibilika, umlomo wokumunca we-tin absorber useduze nendawo yokuncibilika, futhi inkinobho yokukhulula ye-tin absorber icindezelwe.I-piston rod ye-tin absorber izobuyela emuva futhi imunce ithini elincibilikisiwe.Kuphindwe izikhathi eziningana, kungasuswa ebhodini eliphrintiwe.

I-NeoDen ihlinzeka ngezixazululo ezigcwele zomugqa womhlangano we-SMT, okuhlanganisa ihhavini lokugeleza kabusha kwe-SMT, umshini wokunamathisela amaza, umshini wokukhetha nendawo, iphrinta yokunamathisela ye-solder, i-oven ye-Reflow,Isilayishi se-PCB, PCB unloader,i-chip mounter, umshini we-SMT AOI, umshini we-SMT SPI, umshini we-SMT X-Ray, okokusebenza komugqa womhlangano we-SMT, Izisetshenziswa zokukhiqiza ze-PCB Izisetshenziswa ze-SMT eziyisipele, njll.

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