Ireflow ovenisetshenziselwa ukuthengisa izingxenye ze-chip ye-SMT ebhodini lesifunda ohlelweni lwe-SMT lwemishini yokukhiqiza yokudambisa.I-ovini yokugeleza kabusha incike ekugelezeni komoya oshisayo esithandweni ukuxubha inhlama ye-solder emajoyini e-solder paste wesekethe yebhodi, ukuze unamathisele we-solder uncibilike kabusha ube yithini eliwuketshezi ukuze izingxenye ze-chip ye-SMT kanye nebhodi lesifunda. ashiselwe futhi ashiselwe, bese kuthi i-reflow soldering Isithando somlilo sipholile ukuze senze amalunga e-solder, futhi i-colloidal solder paste ibhekana nokusabela ngokomzimba ngaphansi kokugeleza komoya okuthile okushisa okuphezulu ukuze kuzuzwe umphumela wokudambisa wenqubo ye-SMT.
I-soldering kuhhavini yokugeleza kabusha ihlukaniswe ngezinqubo ezine.Amabhodi wesekethe anezingxenye ze-smt athuthwa ngomzila womhlahlandlela we-oven reflow ngokusebenzisa indawo yokushisa, indawo yokugcina ukushisa, indawo yokunamathisela, kanye nendawo yokupholisa ye-ovini yokugeleza kabusha ngokulandelana, bese emva kokuphinda kufakwe i-soldering.Izindawo ezine zokushisa zesithando somlilo zakha indawo yokushisela ephelele.Okulandelayo, i-Guangshengde reflow soldering izochaza izimiso zezindawo ezine zokushisa ze-ovini yokugeleza kabusha ngokulandelanayo.
Ukushisa kuqala ukwenza kusebenze ukunamathisela kwe-solder, kanye nokugwema ukushisa okushesha kakhulu kwezinga lokushisa ngesikhathi sokucwiliswa kwethini, okuyisenzo sokushisa esenziwe ukuze kubangele izingxenye ezingasebenzi kahle.Umgomo wale ndawo ukushisisa i-PCB ekamelweni lokushisa ngokushesha okukhulu, kodwa izinga lokushisa kufanele lilawulwe ngaphakathi kwebanga elifanele.Uma kushesha kakhulu, ukushaqeka okushisayo kuzokwenzeka, futhi ibhodi lesifunda kanye nezingxenye zingalimala.Uma ihamba kancane, i-solvent ngeke ihwamuke ngokwanele.Ikhwalithi yokushisela.Ngenxa yesivinini sokushisa esisheshayo, umehluko wezinga lokushisa esithandweni sokugeleza kabusha mkhulu engxenyeni yokugcina yendawo yokushisa.Ukuze kuvinjwe ukushaqeka okushisayo ekulimazeni izingxenye, izinga lokushisa eliphezulu ngokuvamile licaciswa njengo-4℃/S, futhi izinga lokukhuphuka livamise ukusetha ku-1~3℃/S.
Inhloso eyinhloko yesiteji sokugcina ukushisa ukuzinzisa izinga lokushisa lengxenye ngayinye esithandweni sokugeleza kabusha nokunciphisa umehluko wezinga lokushisa.Nikeza isikhathi esanele kule ndawo ukuze wenze izinga lokushisa lengxenye enkulu lilingane nengxenye encane, futhi uqinisekise ukuthi ukugeleza kwe-solder paste kuguquguquke ngokuphelele.Ekupheleni kwesigaba sokugcina ukushisa, ama-oxides kuma-pads, amabhola e-solder kanye nezikhonkwane zezingxenye zisuswa ngaphansi kwesenzo se-flux, futhi izinga lokushisa lebhodi lesifunda lonke lilinganiselwe.Kumele kuqashelwe ukuthi zonke izingxenye ze-SMA kufanele zibe nezinga lokushisa elifanayo ekupheleni kwalesi sigaba, ngaphandle kwalokho, ukungena esigabeni sokugeleza kabusha kuzodala izenzakalo ezihlukahlukene ezimbi zokudayiswa ngenxa yokushisa okungalingani kwengxenye ngayinye.
Lapho i-PCB ingena endaweni yokugeleza kabusha, izinga lokushisa likhuphuka ngokushesha ukuze unamathisele we-solder ufinyelele esimweni esincibilikisiwe.Iphoyinti lokuncibilika le-lead solder paste 63sn37pb ngu-183°C, futhi indawo yokuncibilika ye-lead solder paste 96.5Sn3Ag0.5Cu ingu-217°C.Kule ndawo, izinga lokushisa lokushisa libekwe phezulu, ukuze izinga lokushisa lengxenye likhuphuke ngokushesha ekushiseni kwenani.Izinga lokushisa lenani lejika lokugeleza livame ukunqunywa izinga lokushisa elincibilikayo le-solder kanye nokushisa kokumelana nokushisa kwe-substrate ehlanganisiwe kanye nezingxenye.Esigabeni sokugeleza kabusha, izinga lokushisa le-solder liyahlukahluka kuye ngokuthi unamathisele i-solder esetshenzisiwe.Ngokuvamile, izinga lokushisa eliphezulu lomthofu lingama-230-250℃, kanti izinga lokushisa lomthofu lingu-210-230℃.Uma izinga lokushisa liphansi kakhulu, kulula ukukhiqiza amalunga abandayo kanye nokumanzisa okwanele;uma izinga lokushisa liphezulu kakhulu, i-coking kanye ne-delamination ye-epoxy resin substrate kanye nezingxenye zepulasitiki kungenzeka zenzeke, futhi izinhlanganisela zensimbi ze-eutectic ngokweqile zizokwakhiwa, okuzoholela ekuhlanganiseni kwe-brittle solder, okuzothinta amandla okushisela.Endaweni ye-reflow soldering, qaphela ngokukhethekile isikhathi sokugeleza kabusha ukuze singabi side kakhulu, ukuvimbela ukulimala kwesithando somlilo, kungase futhi kubangele imisebenzi embi yezingxenye ze-elekthronikhi noma kubangele ukuthi ibhodi lesifunda lishiswe.
Kulesi sigaba, izinga lokushisa liyapholiswa libe ngaphansi kwezinga lokushisa eliqinile ukuze kuqiniswe amalunga e-solder.Izinga lokupholisa lizothinta amandla okuhlangana kwe-solder.Uma izinga lokupholisa lihamba kancane kakhulu, lizobangela ukukhiqizwa kwe-eutectic metal compounds ngokweqile, futhi izakhiwo ezinkulu zokusanhlamvu zivame ukwenzeka emajoyini e-solder, okuzokwehlisa amandla amalunga e-solder.Izinga lokupholisa endaweni yokupholisa ngokuvamile liba ngu-4℃/S, futhi izinga lokupholisa lingu-75℃.kungaba.
Ngemva kokuxubha unamathisele we-solder nokufaka izingxenye ze-smt chip, ibhodi lesifunda lihanjiswa ngesitimela somhlahlandlela wesithando somlilo sokugeleza, futhi ngemva kwesenzo sezindawo ezine zokushisa ezingaphezulu kwesithando somlilo sokugeleza, kwakhiwa ibhodi lesifunda eliphelele elidayisiwe.Lona wonke umgomo wokusebenza kwehhavini lokugeleza kabusha.
Isikhathi sokuthumela: Jul-29-2020