Ulwazi Oluhlobene Ne-Oven

Gcwalisa kabusha ulwazi oluhlobene nohhavini

I-Reflow soldering isetshenziselwa ukuhlanganiswa kwe-SMT, okuyingxenye ebalulekile yenqubo ye-SMT.Umsebenzi wayo ukuncibilikisa ukunamathisela kwe-solder, ukwenza izingxenye zomhlangano ongaphezulu kanye ne-PCB zihlanganiswe ngokuqinile ndawonye.Uma ingakwazi ukulawulwa kahle, izoba nomthelela omubi ekuthembekeni nasekuphileni kwesevisi yemikhiqizo.Kunezindlela eziningi zokwenza i-reflow welding.Izindlela ezidumile zangaphambili ziyi-infrared ne-gas-phase.Manje abakhiqizi abaningi basebenzisa i-hot air reflow welding, kanti ezinye izikhathi ezithuthukile noma ezithile zisebenzisa izindlela zokugeleza kabusha, njengepuleti elishisayo eliyinhloko, ukugxilisa ukukhanya okumhlophe, ihhavini eqondile, njll. Okulandelayo kuzokwenza isingeniso esifushane se-hot air reflow welding ethandwayo.

1. Hot air reflow welding

Manje, izithando zomlilo eziningi ezintsha zibizwa ngokuthi i-convection hot air reflow soldering furnaces.Isebenzisa ifeni yangaphakathi ukuphefumula umoya oshisayo ukuya noma eduze kwepuleti lomhlangano.Enye inzuzo yalesi sithando somlilo ukuthi kancane kancane futhi ngokuqhubekayo inikeza ukushisa epuleti lomhlangano, kungakhathaliseki ukuthi umbala nokuthungwa kwezingxenye.Nakuba, ngenxa yobukhulu obuhlukahlukene kanye nokuminyana kwengxenye, ukumuncwa kokushisa kungase kwehluke, kodwa isithando somlilo esiphoqelelwe siyashisa kancane kancane, futhi umehluko wezinga lokushisa ku-PCB efanayo awuhlukanga kakhulu.Ngaphezu kwalokho, isithando somlilo singakwazi ukulawula ngokuqinile izinga lokushisa eliphezulu nezinga lokushisa lejika lokushisa elinikeziwe, elinikeza indawo engcono yokuzinza kwendawo kanye nenqubo ye-reflux elawulwa kakhulu.

2. Ukusabalalisa kwezinga lokushisa nemisebenzi

Enkambweni ye-hot air reflow welding, i-solder paste idinga ukuhamba ngezigaba ezilandelayo: i-volatilization ye-solvent;ukususwa kwe-flux ye-oxide ebusweni be-weldment;ukuncibilika kwe-solder paste, ukugeleza kabusha kanye nokupholisa kwe-solder paste, nokuqinisa.Ijika lokushisa elivamile (Iphrofayela: ibhekisela ejikeni lapho izinga lokushisa elihlangene le-solder ku-PCB lishintsha ngokuhamba kwesikhathi lapho lidlula esithandweni somlilo sokugeleza kabusha) lihlukaniswe libe yindawo yokushisa, indawo yokugcina ukushisa, indawo yokugeleza kabusha, nendawo yokupholisa.(bona ngenhla)

① Indawo yokushisa kuqala: inhloso yendawo yokushisa kuqala ukushisa i-PCB nezingxenye, ukuzuza ibhalansi, nokukhipha amanzi ne-solvent ku-solder unama, ukuze kuvinjwe ukuwa kwe-solder paste kanye ne-solder spatter.Izinga lokushisa elikhuphukayo lizolawulwa phakathi kwebanga elifanele (ngokushesha kakhulu lizoveza ukushaqeka okushisayo, njengokuqhekeka kwe-multilayer ceramic capacitor, ukufafazwa kwe-solder, ukwakha amabhola e-solder namajoyinti e-solder ane-solder enganele endaweni engashiselwe kuyo yonke i-PCB. ; ukunensa kakhulu kuzowenza buthaka umsebenzi wokuguquguquka).Ngokuvamile, izinga lokushisa eliphezulu lokunyuka lingama-4 ℃ / sec, futhi izinga lokukhuphuka libekwe njenge-1-3 ℃ / sec, okuyindinganiso ye-ECs Ingaphansi kuka-3 ℃ / sec.

② Indawo yokulondoloza ukushisa (esebenzayo): ibhekisela endaweni esuka ku-120 ℃ kuya ku-160 ℃.Inhloso eyinhloko ukwenza izinga lokushisa lengxenye ngayinye ku-PCB livame ukufana, ukunciphisa umehluko wokushisa ngangokunokwenzeka, futhi uqinisekise ukuthi i-solder ingaba yome ngokuphelele ngaphambi kokufinyelela izinga lokushisa lokugeleza kabusha.Ekupheleni kwendawo yokuhlukanisa, i-oxide kuphedi ye-solder, ibhola le-solder paste, nephinikhodi yengxenye kuzosuswa, futhi izinga lokushisa layo yonke ibhodi lesekethe lizolingana.Isikhathi sokucubungula singamasekhondi angu-60-120, kuye ngokuthi uhlobo lwe-solder.Izinga le-ECS: 140-170 ℃, max120sec;

③ Indawo yokugeleza kabusha: izinga lokushisa le-heater kule ndawo libekwe ezingeni eliphezulu kakhulu.Izinga lokushisa eliphakeme le-welding lincike ku-solder paste esetshenzisiwe.Ngokuvamile kunconywa ukwengeza u-20-40 ℃ endaweni yokushisa yephuzu lokuncibilika lokunamathisela kwe-solder.Ngalesi sikhathi, i-solder ku-solder paste iqala ukuncibilika futhi igeleze futhi, ishintsha i-flux ye-liquid ukuze imanzise i-pad kanye nezingxenye.Kwesinye isikhathi, isifunda siphinde sihlukaniswe izifunda ezimbili: indawo encibilikayo kanye nesifunda sokugeleza kabusha.Ijika elifanele lokushisa ukuthi indawo embozwe “indawo ethiphu” ngale kwephuzu lokuncibilika le-solder incane kakhulu futhi iyalingana, ngokuvamile, ibanga lesikhathi elingaphezu kuka-200 ℃ lingamasekhondi angu-30-40.Izinga le-ECS izinga lokushisa eliphakeme kakhulu: 210-220 ℃, ububanzi besikhathi bungaphezu kuka-200 ℃: 40 ± 3sec;

④ Indawo yokupholisa: ukupholisa ngokushesha ngangokunokwenzeka kuzosiza ukuthola amalunga agqamile e-solder anomumo ogcwele kanye ne-angle yokuxhumana ephansi.Ukupholisa kancane kuzoholela ekubolekeni okwengeziwe kwephedi ethini, okuholela ekuhlanganiseni okumpunga nokumaholo, futhi kuholele nasekungcoleni okungekuhle kwethayela kanye nokunamathela okubuthakathaka kwe-solder.Izinga lokupholisa ngokuvamile lingaphakathi - 4 ℃ / isekhondi, futhi lingapholiswa libe cishe ku-75 ℃.Ngokuvamile, ukupholisa okuphoqelelwe ngefeni yokupholisa kuyadingeka.

3. Izici ezihlukahlukene ezithinta ukusebenza kwe-welding

Izici zobuchwepheshe

Welding pretreatment indlela, uhlobo ukwelashwa, indlela, ukujiya, inombolo izingqimba.Kungakhathaliseki ukuthi iyashiswa, iyasikwa noma icutshungulwe ngezinye izindlela phakathi nesikhathi kusukela ekwelapheni kuya ekushiseleni.

Umklamo wenqubo ye-welding

Indawo yokushisela: ibhekisela kusayizi, igebe, ibhande lomhlahlandlela we-gap (izintambo): ukuma, ukuqhutshwa kwe-thermal, umthamo wokushisa wento eshiselwe: ibhekisela ekuqondeni kokushisela, isikhundla, ingcindezi, isimo sokubopha, njll.

Izimo zokushisela

Isho izinga lokushisa lokushisela nesikhathi, izimo zokushisa kuqala, ukushisa, isivinini sokupholisa, imodi yokushisela, uhlobo lwenkampani yenethiwekhi yomthombo wokushisa (ubude begagasi, isivinini sokuqhuba ukushisa, njll.)

impahla yokushisela

I-Flux: ukwakheka, ukugxila, umsebenzi, indawo encibilikayo, indawo yokubilisa, njll

I-Solder: ukwakheka, isakhiwo, okuqukethwe kokungcola, indawo yokuncibilika, njll

Isisekelo sensimbi: ukwakheka, ukwakheka kanye ne-thermal conductivity yensimbi eyisisekelo

I-viscosity, amandla adonsela phansi athile kanye nezakhiwo ze-thixotropic ze-solder paste

I-substrate material, uhlobo, insimbi yokuvala, njll.

I-athikili nezithombe ezivela ku-inthanethi, uma kukhona ukwephulwa komthetho pls okokuqala xhumana nathi ukuze ukususe.
I-NeoDen ihlinzeka ngezixazululo ezigcwele zomugqa womhlangano we-SMT, okuhlanganisa i-oven reflow ye-SMT, umshini wokugcwalisa igagasi, umshini wokukhetha nendawo, iphrinta yokunamathisela i-solder, isilayishi se-PCB, isilayishi se-PCB, isikhuthazi se-chip, umshini we-SMT AOI, umshini we-SMT SPI, umshini we-SMT X-Ray, Imishini yomugqa we-SMT, Izisetshenziswa zokukhiqiza ze-PCB Izingxenye eziyisipele ze-SMT, njll.

I-Hangzhou NeoDen Technology Co., Ltd

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