I-SMT ubuchwepheshe bokukhweza phezulu, okwamanje iwubuchwepheshe nenqubo ethandwa kakhulu embonini yokuhlanganisa i-elekthronikhi.Ukubekwa kwe-SMT kubhekisela ochungechungeni lwezinqubo ezisuselwe ku-PCB ngamafuphi.I-PCB isho ibhodi lesifunda eliphrintiwe.
Inqubo
Izingxenye zenqubo eyisisekelo ye-SMT: ukuphrinta kokunamathisela kwe-solder ->Umshini wokukhweza we-SMTukubekwa -> phezu kwe-ovini yokwelapha ->reflow ovensoldering –> AOI optical inspection –> ukulungisa –> sub-board –> grinding board –> wash board.
1. Ukuphrinta kwe-solder paste: Indima yakho ukuvuza ukunamathisela okungenathayela kumaphedi e-PCB, ukulungiselela ukushiselwa kwezingxenye.Imishini esetshenziswayo umshini wokunyathelisa isikrini, otholakala ngaphambili kulayini wokukhiqiza we-SMT.
2. Isikhuthazi se-chip: indima yaso ukufaka ngokunembile izingxenye zokuhlanganisa ezingaphezulu endaweni egxilile ye-PCB.Izinto ezisetshenziswayo yi-mounter, etholakala kulayini wokukhiqiza we-SMT ngemuva komshini wokuphrinta isikrini.
3. Phezu kokwelapha kuhhavini: indima yakho ukuncibilikisa okunamathelayo kwe-SMD, ukuze izingxenye zomhlangano ongaphezulu kanye nebhodi le-PCB kuhlanganiswe ngokuqinile ndawonye.Imishini esetshenziselwa ukwelapha ihhavini, etholakala kulayini wokukhiqiza we-SMT ngemuva komshini wokubeka.
4. I-Reflow oven soldering: indima yayo ukuncibilikisa unamathisele we-solder, ukuze izingxenye zomhlangano ongaphezulu kanye nebhodi le-PCB kuhlanganiswe ngokuqinile ndawonye.Izinto ezisetshenziswayo i-oven reflow, etholakala kulayini wokukhiqiza we-SMT ngemuva kwebhondi.
5. Umshini we-SMT AOIukuhlolwa kokubona: indima yayo ukuhlanganisa ibhodi le-PCB ngekhwalithi yokushisela kanye nokuhlolwa kwekhwalithi yomhlangano.Imishini esetshenziswayo i-othomathikhi yokuhlola optical (AOI), umthamo we-oda ngokuvamile ungaphezu kwezinkulungwane eziyishumi, umthamo we-oda mncane ngokuhlola ngesandla.Indawo ngokuya ngezidingo zokutholwa, ingalungiswa kumugqa wokukhiqiza endaweni efanele.Okunye ku-reflow soldering ngaphambili, okunye ku-reflow soldering ngemva kwalokho.
6. Ukunakekela: indima yayo ukuthola ukwehluleka kwebhodi le-PCB ekusebenzeni kabusha.Amathuluzi asetshenziswayo ama-ayina ahlanganisiwe, izindawo zokusebenzela kabusha, njll. Alungiselelwe ekuhlolweni kokubona kwe-AOI ngemva kwalokho.
7. I-Sub-board: indima yayo ukusika ibhodi le-PCBA elinezixhumanisi eziningi, ukuze lihlukaniswe ukuze libe umuntu ohlukile, ngokuvamile lisebenzisa i-V-cut kanye nendlela yokusika umshini.
8. Ibhodi lokugaya: indima yalo ukugwaza izingxenye ze-burr, ukuze zibe bushelelezi futhi zibe flat.
9. Ibhodi lokuwasha: indima yalo ukuhlanganisa ibhodi le-PCB ngaphezu kwezinsalela zokushisela eziyingozi ezifana nokukhishwa kwe-flux.Ihlukaniswe ngokuhlanza ngesandla nokuhlanza umshini wokuhlanza, indawo ayikwazi ukulungiswa, ingaba ku-inthanethi, noma ingabi ku-inthanethi.
Izici zeI-NeoDen10umshini wokukhetha nokubeka
I-1.Ihlomisa ikhamera ye-double mark + ikhamera ye-double side enembayo ephezulu eqinisekisa isivinini nokunemba, isivinini sangempela sifika ku-13,000 CPH.Ukusebenzisa i-algorithm yokubala yesikhathi sangempela ngaphandle kwemingcele ebonakalayo yokubala isivinini.
2.Phambili nangemuva ngesizukulwane sesine sesizukulwane sesine sokuqaphela ikhamera endizayo enesivinini esiphezulu, izinzwa ze-US ON, 28mm lens yezimboni, yamashothi endizayo kanye nokubonwa kokunemba okuphezulu.
Amakhanda azimele angu-3.8 anesistimu yokulawula iluphu evalwe ngokugcwele asekela konke okuphakelayo okungu-8mm ngesikhathi esisodwa, ngesivinini esifika ku-13,000 CPH.
4.Sekela ukubekwa kwebha yokukhanya kwe-LED engu-1.5M (ukulungiselela ongakukhetha).
5.Phakamisa i-PCB ngokuzenzakalelayo, igcina i-PCB isezingeni elifanayo ngesikhathi ukubekwa, qinisekisa ukunemba okuphezulu.
Isikhathi sokuthumela: Jun-09-2022