I-PCB Board Substrate Material Classification

Izinhlobo eziningi zama-substrate asetshenziselwa ama-PCB, kodwa ahlukaniswe kabanzi abe izigaba ezimbili, okuyizinto ezisetshenziswayo ezingaphili ne-organic substrate.

Izinto ze-substrate ezingaphili

I-substrate ye-inorganic ikakhulukazi amapuleti e-ceramic, i-ceramic circuit substrate material i-96% ye-alumina, uma idinga i-substrate yamandla aphezulu, i-99% ehlanzekile ye-alumina ingasetshenziswa kodwa ubunzima bokucubungula okuphezulu kwe-alumina, izinga lokukhiqiza liphansi, ngakho-ke ukusetshenziswa kwentengo ye-alumina emsulwa kuphezulu.I-Beryllium oxide nayo iyimpahla ye-ceramic substrate, iyi-oxide yensimbi, inezindawo ezinhle zokuvala ugesi kanye ne-thermal conductivity enhle kakhulu, ingasetshenziswa njenge-substrate yamasekhethi aphezulu wokuminyana kwamandla.

Ama-Ceramic circuit substrates asetshenziswa kakhulu kumasekethe ahlanganisiwe wefilimu aminyene nancane, ama-multi-chip micro-assembly circuits, anezinzuzo zokuthi ama-substrates wesifunda se-organic angeke afane.Isibonelo, i-CTE ye-ceramic circuit substrate ingakwazi ukufanisa i-CTE yezindlu ze-LCCC, ngakho-ke ukwethembeka okuhle kwe-solder kuzotholakala lapho kuhlanganiswa amadivaysi e-LCCC.Ukwengeza, ama-substrates e-ceramic afanele inqubo yokuhwamuka kwe-vacuum ekukhiqizeni ama-chip ngoba awakhiphi inani elikhulu lamagesi adsorbed abangela ukwehla kwezinga le-vacuum ngisho nalapho kushisa.Ngaphezu kwalokho, ama-substrates e-ceramic nawo anokumelana nokushisa okuphezulu, ukuqedwa okuhle kwendawo, ukusimama okuphezulu kwamakhemikhali, i-substrate yesekethe ekhethwayo yamasekethe ama-hybrid amafilimu aminyene nama-multi-chip micro-assembly.Kodwa-ke, kunzima ukucubungula ibe yi-substrate enkulu futhi eyisicaba, futhi ayikwazi ukwenziwa ibe yisakhiwo sebhodi lesitembu esihlanganisiwe esinezingxenye eziningi ukuze kuhlangatshezwane nezidingo zokukhiqiza okuzenzakalelayo Ngaphezu kwalokho, ngenxa ye-dielectric engaguquki yezinto zobumba, ngakho-ke futhi ayifanelekile kuma-substrates wesifunda esinesivinini esikhulu, futhi intengo iphakeme kakhulu.

Izinto ze-organic substrate

Izinto ze-Organic substrate zenziwe ngezinto eziqinisayo njengendwangu ye-fiber yengilazi (iphepha le-fiber, i-glass mat, njll.), ifakwe nge-resin binder, yomiswe ibe yinto engenalutho, bese imbozwa nge-foil yethusi, futhi yenziwe ngokushisa okuphezulu nokucindezela.Lolu hlobo lwe-substrate lubizwa nge-copper-clad laminate (CCL), evame ukubizwa ngokuthi amaphaneli e-copper-clad, iyinto eyinhloko yokukhiqiza ama-PCB.

I-CCL izinhlobo eziningi, uma izinto eziqinisayo ezisetshenziselwa ukuhlukanisa, zingahlukaniswa zibe izigaba ezine ezisekelwe ephepheni, ingilazi ye-fiber cloth, i-composite base (CEM) kanye nezigaba ezine ezisekelwe ensimbi;ngokusho kwe-organic resin binder esetshenziselwa ukuhlukanisa, futhi ingahlukaniswa ibe yi-phenolic resin (PE) epoxy resin (EP), i-polyimide resin (PI), i-polytetrafluoroethylene resin (TF) ne-polyphenylene ether resin (PPO);uma i-substrate iqinile futhi iguquguquka ukuze ihlukanise, futhi ingahlukaniswa ibe yi-CCL eqinile ne-CCL eguquguqukayo.

Njengamanje esetshenziswa kabanzi ekukhiqizeni i-PCB enamacala amabili i-epoxy glass fiber circuit substrate, ehlanganisa izinzuzo zamandla amahle we-glass fibre kanye ne-epoxy resin toughness, enamandla amahle kanye ne-ductility.

I-epoxy glass fiber circuit substrate yenziwa ngokufaka kuqala i-epoxy resin engutsheni yengilazi yefiber ukwenza i-laminate.Ngesikhathi esifanayo, amanye amakhemikhali ayengezwa, njengama-ejenti okwelapha, ama-stabilizers, ama-anti-flammability agents, ama-adhesives, njll. Khona-ke i-foil yethusi inamathiselwe futhi icindezelwe ohlangothini olulodwa noma zombili ze-laminate ukuze wenze i-epoxy glass fiber ene-copper-clad. laminate.Ingasetshenziselwa ukwenza ama-PCB ahlukene anohlangothi olulodwa, anezinhlangothi ezimbili kanye nama-PCB amaningi.