1. ngemva kokukhiqizwa nokucutshungulwa kwe-PCB, ukupakishwa kwe-vacuum kufanele kusetshenziswe okokuqala ngqa.Kufanele kube ne-desiccant esikhwameni sokupakisha se-vacuum futhi ukupakishwa kuseduze, futhi akukwazi ukuthintana namanzi nomoya, ukuze kugwenywe ukudayiswa kwe-solder.reflow ovenkanye nekhwalithi yomkhiqizo ethintwa i-tin spray ebusweni be-PCB kanye ne-oxidation ye-solder pad.
2. I-PCB kufanele ibekwe futhi ilebulwe ngezigaba.Ngemuva kokuvalwa, amabhokisi kufanele ahlukaniswe abe yizindonga, futhi akufanele abekwe elangeni.Kufanele igcinwe kukhabhinethi yokugcina umoya futhi eyomile enendawo enhle yokugcina (izinga lokushisa: 22-27 degrees, umswakama: 50-60%).
3. amabhodi wesifunda we-PCB angasetshenziswa isikhathi eside, kungcono ukuxubha ubuso bebhodi lesifunda le-PCB ngopende olunobufakazi obuthathu, obungaba umswakama, uthuli kanye ne-anti-oxidation, ukuze impilo yokugcina Amabhodi esekethe e-PCB anganyuswa abe yizinyanga eziyisi-9.
4. Ipheshi le-PCB elingapakishiwe lingagcinwa izinsuku eziyi-15 ngaphansi kwezinga lokushisa elingashintshi kanye nomswakama, futhi kungabi ngaphezu kwezinsuku ezi-3 ngaphansi kwezinga lokushisa elivamile;
5. I-PCB kufanele isetshenziswe zingakapheli izinsuku ezi-3 ngemva kokuqaqa.Uma ingasetshenziswanga, vacuum seal ngesikhwama esimile futhi.
6. Ibhodi PCBA ngemvaUmshini we-SMTifakwe futhi i-DIP kufanele ithuthwe futhi ibekwe nobakaki ophikisayo.
Isikhathi sokuthumela: Aug-20-2021