1. BGA(uhlu lwegridi yebhola)
Isibonisi sothintana nebhola, elinye lamaphakheji ohlobo lokukhweza phezulu.Amaqhuqhuva ebhola enziwa ngemuva kwe-substrate ephrintiwe ukuze kuthathelwe indawo izikhonkwane ngokuhambisana nendlela yokubonisa, futhi i-chip ye-LSI ihlanganiswa ngaphambi kwe-substrate ephrintiwe bese ivalwa nge-resin ebunjiwe noma indlela yokubumba.Lokhu kuphinde kubizwe nge-bump display carrier (PAC).Izikhonkwane zingadlula ama-200 futhi ziwuhlobo lwephakheji elisetshenziselwa amaphini amaningi we-LSI.Umzimba wephakeji ungenziwa futhi ube mncane kune-QFP (iphakethe le-quad side pin flat).Isibonelo, i-BGA yamaphini angu-360 enezikhungo zamaphini angu-1.5mm isikwele esingu-31mm kuphela, kuyilapho i-QFP engamaphini angu-304 enezikhungo zamaphini angu-0.5mm iyisikwele esingu-40mm.Futhi i-BGA akudingeki ikhathazeke ngokuguqulwa kwephini njenge-QFP.Iphakheji yathuthukiswa yi-Motorola e-United States futhi yaqala ukusetshenziswa kumadivayisi afana namafoni aphathwayo, futhi kungenzeka ukuthi idume e-United States kumakhompyutha womuntu ngokuzayo.Ekuqaleni, ibanga eliphakathi lephinikhodi (i-bump) le-BGA lingu-1.5mm futhi inani lamaphini ngu-225. I-BGA yamaphini angu-500 nayo ithuthukiswa abanye abakhiqizi be-LSI.inkinga ye-BGA wukuhlolwa kokubukeka ngemuva kokugeleza kabusha.
2. BQFP(quad flat package enobhampa)
Iphakethe le-quad flat elinobhampa, elinye lamaphakheji e-QFP, linamabhampa (bumper) emakhoneni amane omzimba wephakheji ukuvimbela ukugoba kwezikhonkwane ngesikhathi sokuthunyelwa.Abakhiqizi be-semiconductor base-US basebenzisa le phakheji ikakhulukazi kumasekhethi afana nama-microprocessors nama-ASIC.Ibanga eliphakathi nendawo lokuphina lingu-0.635mm, inani lamaphini lisuka ku-84 liye ku-196 noma ngaphezulu.
3. I-Bump solder PGA(i-butt joint pin grid array) Isibizo se-surface mount PGA.
4. C-(i-ceramic)
Uphawu lwephakheji ye-ceramic.Isibonelo, i-CDIP isho i-ceramic DIP, evame ukusetshenziswa ekusebenzeni.
5. Cerdip
Iphakheji ye-Ceramic ephindwe kabili yomugqa evalwe ngengilazi, esetshenziselwa i-ECL RAM, i-DSP (I-Digital Signal Processor) namanye amasekhethi.I-Cerdip enefasitela lengilazi isetshenziselwa uhlobo lwe-UV erasure EPROM namasekhethi e-microcomputer ane-EPROM ngaphakathi.Ibanga le-pin centre lingu-2.54mm kanti isibalo samaphini sisuka ku-8 siye ku-42.
6. I-Cerquad
Elinye lamaphakheji angaphezulu, i-ceramic QFP ene-underseal, isetshenziselwa ukupakisha amasekethe e-LSI anengqondo njengama-DSP.I-Cerquad enefasitela isetshenziselwa ukupakisha amasekhethi e-EPROM.Ukukhipha ukushisa kungcono kunama-QFP epulasitiki, okuvumela amandla angu-1.5 kuye ku-2W ngaphansi kwezimo zokupholisa komoya zemvelo.Kodwa-ke, izindleko zephakeji ziphakeme izikhathi ezi-3 kuye kwezi-5 kune-QFPs yepulasitiki.Ibanga eliphakathi kwephinikhodi lingu-1.27mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm, njll. Inani lamaphini lisukela ku-32 kuya ku-368.
7. I-CLCC (isithwali se-ceramic leaded chip)
Isithwali se-Ceramic leaded chip esinezikhonkwane, enye yephakethe le-surface Mount, izikhonkwane ziholwa ezinhlangothini ezine zephakeji, ngesimo se-ding.Ngefasitela lephakheji yohlobo lwe-UV erasure EPROM kanye nesekethe ye-microcomputer ene-EPROM, njll. Le phakheji ibizwa nangokuthi QFJ, QFJ-G.
8. I-COB (i-chip ebhodini)
I-chip on board package ingenye yobuchwepheshe bokufakwa kwe-chip engenalutho, i-semiconductor chip ifakwe ebhodini lesifunda eliphrintiwe, uxhumano lukagesi phakathi kwe-chip ne-substrate lwenziwa ngendlela yokuthunga umthofu, uxhumano lukagesi phakathi kwe-chip ne-substrate lwenziwa ngendlela yokuthunga umthofu. , futhi imbozwe nge-resin ukuqinisekisa ukwethembeka.Nakuba i-COB iwubuchwepheshe obulula kakhulu bokukhweza i-chip, kodwa ukuminyana kwephakeji yayo kuphansi kakhulu kune-TAB kanye nobuchwepheshe be-chip soldering obuhlanekezelwe.
9. I-DFP(iphakheji eliyisicaba)
Iphakeji eliyisicaba lephinikhodi elihlangothini eliphindwe kabili.Yigama le-SOP.
10. I-DIC(iphakheji ye-ceramic ekabili emgqeni)
I-Ceramic DIP (ene-glass seal) alias.
11. DIL(okukabili kulayini)
Isibizo se-DIP (bona i-DIP).Abakhiqizi be-semiconductor base-Europe basebenzisa kakhulu leli gama.
12. I-DIP(iphakeji elikumugqa elikabili)
Iphakeji elikumugqa kabili.Enye yephakeji ye-cartridge, izikhonkwane ziholwa ezinhlangothini zombili zephakheji, impahla yephakheji inezinhlobo ezimbili zepulasitiki ne-ceramic.I-DIP iyiphakheji ye-cartridge ethandwa kakhulu, izinhlelo zokusebenza zifaka i-logic evamile ye-IC, imemori ye-LSI, amasekhethi e-microcomputer, njll. Ibanga lesikhungo sephinikhodi lingu-2.54mm futhi inani lamaphini lisukela ku-6 kuya ku-64. ububanzi bephakheji ngokuvamile bungu-15.2mm.amanye amaphakheji anobubanzi obungu-7.52mm no-10.16mm abizwa ngokuthi i-skinny DIP kanye ne-DIP encane ngokulandelanayo.Ngaphezu kwalokho, ama-DIP e-ceramic avaliwe ngengilazi encibilika ephansi abizwa nangokuthi i-cerdip (bona i-cerdip).
13. I-DSO(ilinti elincane elikabili)
Isibizo se-SOP (bona i-SOP).Abanye abakhiqizi be-semiconductor basebenzisa leli gama.
14. I-DICP(iphakheji yenkampani yenethiwekhi yetheyiphu ekabili)
Enye ye-TCP (iphakheji yenkampani yenethiwekhi).Izikhonkwane zenziwe nge-tape yokuvikela futhi ziphuma ezinhlangothini zombili zephakheji.Ngenxa yokusetshenziswa kobuchwepheshe be-TAB (i-automatic tape carrier soldering) ubuchwepheshe, iphrofayili yephakheji incane kakhulu.Isetshenziswa kakhulu kuma-LCD driver LSIs, kodwa iningi lawo enziwe ngokwezifiso.Ngaphezu kwalokho, iphakheji yencwajana ye-LSI yenkumbulo ewugqinsi engu-0.5mm isathuthukiswa.E-Japan, i-DICP ibizwa nge-DTP ngokwezinga le-EIAJ (Izimboni Ze-elekthronikhi kanye Nemishini yase-Japan).
15. I-DIP(iphakheji yenkampani yenethiwekhi yamatheyiphu amabili)
Okufanayo nangenhla.Igama le-DTCP elisezingeni le-EIAJ.
16. FP(flat package)
Iphakheji flat.Isibizo se-QFP noma i-SOP (bona i-QFP ne-SOP).Abanye abakhiqizi be-semiconductor basebenzisa leli gama.
17. flip-chip
Flip-chip.Obunye bobuchwepheshe bokupakisha be-bare-chip lapho iqhubu lensimbi lenziwa khona endaweni ye-electrode ye-chip ye-LSI bese kuthi iqhubu lensimbi lidayiswe ngokucindezela endaweni ye-electrode ku-substrate ephrintiwe.Indawo ehlala iphakheji ngokuyisisekelo ilingana nosayizi we-chip.Incane futhi mncane kunabo bonke ubuchwepheshe bokupakisha.Kodwa-ke, uma i-coefficient yokunwetshwa okushisayo kwe-substrate ihlukile kune-chip ye-LSI, ingasabela ekuhlanganyeleni futhi ngaleyo ndlela ithinte ukuthembeka kokuxhumeka.Ngakho-ke, kuyadingeka ukuqinisa i-chip ye-LSI nge-resin futhi usebenzise i-substrate material cishe ne-coefficient efanayo yokunwetshwa kwe-thermal.
18. FQFP(fine pitch quad flat package)
I-QFP enebanga elincane lesikhungo sephini, ngokuvamile elingaphansi kuka-0.65mm (bona i-QFP).Abanye abakhiqizi bekhondakta basebenzisa leli gama.
19. I-CPAC(i-globe top pad array carrier)
Isibizo se-Motorola se-BGA.
20. I-CQFP(iphakethe le-quad fiat elinendandatho yonogada)
Iphakethe le-quad fiat elinendandatho yonogada.Enye yama-QFP epulasitiki, izikhonkwane zimbozwe ngendandatho ye-resin evikelayo ukuvimbela ukugoba nokuguqulwa.Ngaphambi kokuhlanganisa i-LSI ku-substrate ephrintiwe, izikhonkwane zisikwa kusuka endandatho yokuqapha futhi zenziwe zibe yi-seagull shape shape (L-shape).Le phakheji ikhiqizwa ngobuningi e-Motorola, e-USA.Ibanga lesikhungo sephini liyi-0.5mm, kanti inani eliphezulu lamaphini lingaba ngu-208.
21. H-(enesinki lokushisa)
Ibonisa uphawu olunosinki wokushisa.Isibonelo, i-HSOP ikhombisa i-SOP enosinki wokushisa.
22. pin grid array(uhlobo lokukhweza okungaphezulu)
I-PGA yohlobo lokukhweza ngaphezulu imvamisa iyiphakheji yohlobo lwekhatriji enobude bephinikhodi obungaba ngu-3.4mm, futhi uhlobo lwe-PGA lokukhweza lunombukiso wamaphini ohlangothini olungezansi lwephakheji enobude obusuka ku-1.5mm ukuya ku-2.0mm.Njengoba ibanga lesikhungo sephini liyi-1.27mm kuphela, okuyisigamu sobukhulu be-cartridge yohlobo lwe-PGA, umzimba wephakheji ungenziwa ube mncane, futhi inani lezikhonkwane lingaphezu kohlobo lwe-cartridge (250-528), ngakho-ke iyiphakheji esetshenziselwa i-LSI yengqondo yezinga elikhulu.Ama-substrates ephakheji ama-substrates e-ceramic amaningi kanye nama-glass epoxy resin substrates okuphrinta.Ukukhiqizwa kwamaphakheji anama-substrates e-ceramic amaningi sekuye kwaba usizo.
23. I-JLCC (Isithwali se-chip esiholwa ngu-J)
Isithwali sephinikhodi esimise okuka-J.Isho i-CLCC enewindi kanye nezibizo ze-ceramic QFJ ezinewindi (bona i-CLCC ne-QFJ).Abanye babakhiqizi be-semi-conductor basebenzisa igama.
24. I-LCC (Isithwali se-chip esingenantambo)
Isithwali se-chip engenaphini.Isho iphakethe lokukhweza okungaphezulu lapho kuphela ama-electrode ezinhlangothini ezine ze-substrate ye-ceramic axhumene ngaphandle kwezikhonkwane.Iphakheji ye-IC enesivinini esikhulu nemvamisa ephezulu, eyaziwa nangokuthi i-ceramic QFN noma i-QFN-C.
25. LGA (uhlelo lwegridi yomhlaba)
Xhumana nephakheji yokubonisa.Kuyiphakheji enoxhaxha loxhumana nabo ohlangothini olungezansi.Uma ihlangene, ingafakwa kusokhethi.Kukhona abathintwayo abangu-227 (ibanga elimaphakathi eli-1.27mm) kanye noxhumana nabo abangu-447 (ibanga eliphakathi nendawo elingu-2.54mm) lama-LGA e-ceramic, asetshenziswa kumasekhethi e-LSI anengqondo ngesivinini esiphezulu.Ama-LGA angakwazi ukwamukela amaphinikhodi okokufaka nokukhiphayo ephaketheni elincane kunama-QFP.Ngaphezu kwalokho, ngenxa yokumelana okuphansi kwemikhondo, kufanelekile i-LSI yesivinini esikhulu.Kodwa-ke, ngenxa yobunzima kanye nezindleko eziphakeme zokwenza amasokhethi, awasetshenziswa kakhulu manje.Isidingo sabo kulindeleke ukuthi sikhule ngokuzayo.
26. LOC(lead on chip)
Ubuchwepheshe bokupakisha be-LSI buyisakhiwo lapho ingxenye engaphambili yohlaka lomthofu ingaphezulu kwe-chip kanye nejoyinti le-solder eliqhumayo lenziwa eduze nendawo emaphakathi ye-chip, futhi uxhumano lukagesi lwenziwa ngokuhlanganisa umkhondo ndawonye.Uma kuqhathaniswa nesakhiwo sokuqala lapho uhlaka oluholayo lubekwe eduze kohlangothi lwe-chip, i-chip ingafakwa kuphakheji yosayizi ofanayo ngobubanzi obungaba ngu-1mm.
27. I-LQFP (iphakethe le-quad flat profile ephansi)
I-QFP Ezacile isho ama-QFP anogqinsi lomzimba wephakheji ongu-1.4mm, futhi igama elisetshenziswa i-Japan Electronics Machinery Industry Association ngokuvumelana nokucaciswa kwesici esisha sefomu le-QFP.
28. L-QUAD
Enye ye-ceramic QFPs.I-Aluminium nitride isetshenziselwa i-substrate yephakheji, futhi ukushisa okushisayo kwesisekelo kuphakama izikhathi ezingu-7 kuya kwezingu-8 kune-aluminium oxide, ehlinzeka ngokukhipha ukushisa okungcono.Uhlaka lwephakeji lwenziwe nge-aluminium oxide, futhi i-chip ivalwa ngendlela yokubumba, ngaleyo ndlela kucindezela izindleko.Kuyiphakheji eyenzelwe i-logic LSI futhi ingamukela amandla e-W3 ngaphansi kwezimo zokupholisa komoya zemvelo.Amaphakheji angu-208-pin (0.5mm center pitch) kanye ne-160-pin (0.65mm center pitch) omqondo we-LSI athuthukisiwe futhi afakwa ekukhiqizweni ngobuningi ngo-Okthoba 1993.
29. MCM(multi-chip module)
I-Multi-chip module.Iphakheji lapho ama-chips angenalutho we-semiconductor ahlanganiswa khona ku-substrate yezintambo.Ngokusho kwe-substrate material, ingahlukaniswa izigaba ezintathu, i-MCM-L, i-MCM-C ne-MCM-D.I-MCM-L iyinhlangano esebenzisa i-glass epoxy resin multilayer ephrintiwe substrate evamile.Ayiminyene futhi ayibizi kangako.I-MCM-C iyingxenye esebenzisa ubuchwepheshe befilimu ewugqinsi ukuze yakhe izintambo zezendlalelo eziningi nge-ceramic (i-alumina noma i-glass-ceramic) njenge-substrate, efana ne-ICs yefilimu eyingxubevange esebenzisa ama-substrates e-ceramic amaningi.Awukho umehluko obalulekile phakathi kwakho kokubili.Ukuminyana kwezintambo kungaphezulu kwalokho kwe-MCM-L.
I-MCM-D iyingxenye esebenzisa ubuchwepheshe befilimu encane ukwenza izintambo zezendlalelo eziningi nge-ceramic (i-alumina noma i-aluminium nitride) noma i-Si ne-Al njengama-substrates.Ubuningi bezintambo buphakeme kakhulu phakathi kwezinhlobo ezintathu zezingxenye, kodwa izindleko nazo ziphezulu.
30. MFP(iphakheji elincane eliyisicaba)
Iphakethe elincane eliyisicaba.Isibizo sepulasitiki SOP noma i-SSO (bona i-SOP ne-SSO).Igama elisetshenziswa abanye abakhiqizi be-semiconductor.
31. MQFP(metric quad flat package)
Ukuhlukaniswa kwama-QFP ngokwezinga le-JEDEC (Joint Electronic Devices Committee).Isho i-QFP evamile enebanga eliphakathi nendawo lephinikhodi elingu-0.65mm nogqinsi lomzimba olungu-3.8mm kuya ku-2.0mm (bona i-QFP).
32. MQUAD(i-metal quad)
Iphakethe le-QFP elakhiwe ngu-Olin, e-USA.I-base plate nekhava yenziwe nge-aluminium futhi ivalwe nge-adhesive.Ingavumela u-2.5W~2.8W wamandla ngaphansi kwesimo semvelo sokupholisa umoya.U-Nippon Shinko Kogyo unikezwe ilayisensi yokuqala ukukhiqiza ngo-1993.
33. MSP(iphakheji elincane lesikwele)
Isibizo se-QFI (bona i-QFI), ekuqaleni kwentuthuko, ebizwa kakhulu ngokuthi i-MSP, i-QFI igama elinqunywe yi-Japan Electronics Machinery Industry Association.
34. I-OPMAC(ngaphezu kwesithwali sephedi elibunjiwe)
Inkampani yenethiwekhi yokubonisa iqhubu evala inhlaka.Igama elisetshenziswa i-Motorola ekuhlanganiseni i-resin ehlanganisiwe ye-BGA (bona i-BGA).
35. P-(ipulasitiki)
Ibonisa incazelo yephakheji yepulasitiki.Isibonelo, i-PDIP isho i-plastic DIP.
36. I-PAC(i-pad array carrier)
I-Bump display carrier, isibizo se-BGA (bona i-BGA).
37. I-PCLP(iphakethe lebhodi lesifunda eliphrintiwe elingenalutho)
Iphakethe lebhodi lesifunda eliphrintiwe elingaholile.Ibanga lesikhungo sephini linezici ezimbili: 0.55mm no-0.4mm.Njengamanje esigabeni sokuthuthukiswa.
38. PFPF(plastic flat package)
Iphakethe lepulasitiki eliyisicaba.Isibizo se-QFP yepulasitiki (bona i-QFP).Abanye abakhiqizi be-LSI basebenzisa igama.
39. PGA(pin grid array)
Phina iphakheji yohlu.Elinye lamaphakheji ohlobo lwe-cartridge lapho amaphini aqondile ohlangothini olungezansi ahlelwa khona ngephethini yokubonisa.Ngokuyisisekelo, ama-substrates e-ceramic amaningi asetshenziselwa i-substrate yephakheji.Ezimeni lapho igama lempahla lingaboniswanga ngokuqondile, iningi lingama-PGA e-ceramic, asetshenziselwa amasekhethi e-LSI anesivinini esikhulu, anengqondo enkulu.Izindleko ziphezulu.Izikhungo zamaphini ngokuvamile zihlukana ngo-2.54mm futhi izibalo zamaphini zisukela ku-64 kuya cishe ku-447. Ukuze kuncishiswe izindleko, indawo engaphansi yephakheji ingashintshwa yingxenye yengilazi ephrintiwe ye-epoxy substrate.Ipulasitiki engu-PG A enamaphini angu-64 kuya kwangu-256 nayo iyatholakala.Kukhona nendawo yokukhweza yephinikhodi emfushane yohlobo lwe-PGA (i-touch-solder PGA) enebanga lesikhungo sephini elingu-1.27mm.(Bheka uhlobo lokukhweza phezulu kwe-PGA).
40. Piggy emuva
Iphakheji epakishiwe.Iphakheji le-ceramic elinesokhethi, elifana nesimo se-DIP, QFP, noma i-QFN.Isetshenziswa ekuthuthukisweni kwamadivayisi anama-microcomputer ukuze kuhlolwe ukusebenza kokuqinisekiswa kohlelo.Isibonelo, i-EPROM ifakwe kusokhethi ukuze kulungiswe iphutha.Le phakheji iwumkhiqizo wangokwezifiso futhi ayitholakali kakhulu emakethe.
Isikhathi sokuthumela: May-27-2022