Izidingo Zokuklama ze-PCBA

I. Isendlalelo

PCBA Welding uyamukelai-hot air reflow soldering, encike ekuhanjisweni komoya kanye nokuqhutshwa kwe-PCB, i-welding pad kanye nentambo yomthofu yokufudumeza.Ngenxa yomthamo wokushisa ohlukene kanye nezimo zokushisa zamaphedi nezikhonkwane, izinga lokushisa lokushisa lamaphedi nezikhonkwane ngesikhathi esifanayo kwinqubo yokushisa ye-welding ye-reflow nayo ihlukile.Uma umehluko wezinga lokushisa umkhulu uma kuqhathaniswa, kungase kubangele ukushisela okungekuhle, njenge-QFP pin open welding, ukumunca intambo;Ukumiswa kwe-Stele kanye nokususwa kwezingxenye ze-chip;Ukuqhekeka kwe-Shrinkage ye-BGA solder joint.Ngokufanayo, singakwazi ukuxazulula ezinye izinkinga ngokushintsha umthamo wokushisa.

II.Izidingo zokuklama
1. Ukuklanywa kwamaphedi okushisa okushisa.
Ekushiseleni izakhi ze-heat sink, kukhona ukuntuleka kwethini kuma-pads okushisa okushisa.Lolu uhlelo lokusebenza olujwayelekile olungathuthukiswa ngokuklama kukasinki wokushisa.Kulesi simo esingenhla, ingasetshenziswa ukwandisa umthamo wokushisa womklamo wembobo yokupholisa.Xhuma imbobo ekhipha imisebe kungqimba lwangaphakathi oluxhuma i-stratum.Uma ukuxhuma kwe-stratum kungaphansi kwezingqimba ezi-6, kungahlukanisa ingxenye kusuka kungqimba lwesignali njengongqimba olukhipha imisebe, kuyilapho kunciphisa usayizi wokuvula ube ubuncane bosayizi wokuvula otholakalayo.

2. Idizayini ye-jacking yamandla aphezulu.
Kweminye imiklamo yomkhiqizo ekhethekile, izimbobo zekhathriji kwesinye isikhathi zidinga ukuxhunywa kungqimba olungaphezulu kwendawo eyodwa/yezinga eliphezulu.Ngoba isikhathi sokuxhumana phakathi kwephini kanye negagasi lethini lapho i-wave soldering imfushane kakhulu, okungukuthi, isikhathi sokushisela sivame ukuba ngu-2 ~ 3S, uma umthamo wokushisa wesokhethi mkhulu, izinga lokushisa lokuhola lingase lingahlangani. izidingo Welding, ukwakha abandayo Welding iphuzu.Ukuvimbela lokhu ukuthi kungenzeki, umklamo obizwa ngokuthi i-star-moon hole uvame ukusetshenziswa, lapho imbobo ye-weld ihlukaniswa nomhlabathi / ungqimba lukagesi, futhi umsinga omkhulu udlula emgodini wamandla.

3. Idizayini ye-BGA solder joint.
Ngaphansi kwezimo zenqubo yokuxuba, kuzoba nesenzakalo esikhethekile "se-shrinkage fracture" esibangelwa ukuqina okungafaniyo kwamalungu e-solder.Isizathu esiyisisekelo sokwakheka kwalesi sici izici zenqubo yokuxuba ngokwayo, kodwa ingathuthukiswa ngokuklanywa kokwenza kahle kwe-BGA ye-wiring ukuze kunciphe ukupholisa.
Ngokusho kokuhlangenwe nakho kokucutshungulwa kwe-PCBA, ijoyinti le-solder lokuqhekeka elijwayelekile litholakala ekhoneni le-BGA.Ngokwandisa umthamo wokushisa wejoyinti ye-solder yekhona le-BGA noma ukunciphisa isivinini sokuqhuba ukushisa, ingavumelanisa namanye amalunga e-solder noma ipholise phansi, ukuze igweme ukwenzeka kokuphulwa ngaphansi kwengcindezi ye-BGA warping ebangelwa ukupholisa kuqala.

4. Ukuklanywa kwamaphedi engxenye ye-chip.
Ngosayizi omncane noma omncane wezingxenye ze-chip, kunezigigaba eziningi njengokugudluka, ukulungiselelwa kwe-stile nokuphenduka.Ukwenzeka kwalezi zenzakalo kuhlobene nezici eziningi, kodwa ukwakheka okushisayo kwamaphedi kuyisici esibaluleke kakhulu.Uma umkhawulo owodwa wepuleti welding enokuxhumana okubanzi ngocingo, ngakolunye uhlangothi ngocingo oluwumngcingo, ngakho-ke ukushisa ezinhlangothini zombili zezimo kuhlukile, ngokuvamile ngocingo olubanzi lokuxhumana luzoncibilika (ukuthi, ngokungafani umcabango ojwayelekile, umcabango ohlale ucatshangelwe kanye nephedi yokuxhumeka kwentambo ebanzi ngenxa yomthamo omkhulu wokushisa nokuncibilika, ucingo olubanzi empeleni lwaba umthombo wokushisa, Lokhu kuncike ekutheni i-PCBA ishisa kanjani), futhi ukungezwani komhlaba okukhiqizwa ukuphela kokuqala okuncibilikisiwe nakho kungashintsha. noma uphenye i-elementi.
Ngakho-ke, ngokuvamile kuthenjwa ukuthi ububanzi bentambo exhunywe nephedi akufanele bube ngaphezu kwengxenye yobude bohlangothi lwephedi exhunyiwe.

I-oven ye-NeoDen Reflow