Isici Sezimbobo Zokuqhumisa Ku-PCB

Phina Izimbobo & Vuthela Izimbobo Ebhodini Lesekethe Eliphrintiwe

Izimbobo zokukhonkotha noma izimbobo zokushaywa ziyinto efanayo futhi ebangelwa ukuphuma kwebhodi eliphrintiwe ngesikhathi sokuhlanganisa.Ukwakhiwa kwembobo yokuphina nokuvuthela ngesikhathi sokufakwa kwamagagasi ngokuvamile kuhlotshaniswa nogqinsi lwe-copper plating.Umswakama ebhodini uphuma nge-copper plating emincane noma izikhala ekucwecweni.Ukufakwa emgodini ophumela embobeni kufanele kube ubuncane obungama-25um ukuze kumiswe umswakama osebhodini uphenduke umhwamuko wamanzi bese ukhipha umoya odongeni lwethusi ngesikhathi sokusongeshwa kwamagagasi.

Igama elithi pin noma i-blow hole ngokuvamile lisetshenziselwa ukukhombisa usayizi wembobo, iphini lincane.Usayizi uncike kuphela kumthamo womhwamuko wamanzi ophumayo kanye nendawo lapho usoda eqina khona.

Umfanekiso 1: Vula Imbobo

Okuwukuphela kwendlela yokuqeda le nkinga ukuthuthukisa ikhwalithi yebhodi ngobuncane obungama-25um wokucwecwa ngethusi emgodini odlulayo.Ukubhaka kuvame ukusetshenziselwa ukuqeda izinkinga zegesi ngokumisa ibhodi.Ukubhaka ibhodi kuthatha amanzi ebhodini, kodwa akuxazululi imbangela yenkinga.

Umfanekiso 2: I-Pin Hole

Ukuhlola Okungonakali Kwezimbobo Ze-PCB

Ukuhlolwa kusetshenziselwa ukuhlola amabhodi esekethe aphrintiwe afakwe emigodini yokukhipha umoya.Ibonisa izehlakalo zokucwenga okuncanyana noma izikhala ezikhona ngokuxhunywa kwezimbobo.Ingase isetshenziselwe irisidi yezimpahla, ngesikhathi sokukhiqiza noma emibuthanweni yokugcina ukuze kutholakale imbangela ye-voids ku-solder fillets.Kuncike ekutheni ukunakekelwa kuthathwa ngesikhathi sokuhlolwa amabhodi angasetshenziswa ekukhiqizeni ngemva kokuhlolwa ngaphandle kokulimala ekubukekeni okubonakalayo noma ukwethembeka komkhiqizo wokugcina.

Izisetshenziswa zokuhlola

• Isampula yamabhodi esekethe aphrintiwe ukuze ahlolwe
• Amafutha e-Canada Bolson noma enye indlela efanelekile ecacile ngokusobala ukuze ihlolwe futhi ingasuswa kalula ngemva kokuhlolwa
• Isipetu se-Hypodermic sokufakwa kwamafutha emgodini ngamunye
• Iphepha lokuvala lokukhipha uwoyela oweqile
• Isibonakhulu esinokukhanya okuphezulu nangaphansi.Kungenjalo, insiza efanelekile yokukhulisa ephakathi kuka-5 kuya ku-25x wokukhulisa kanye nebhokisi elikhanyayo.
• I-soldering iron enokulawula izinga lokushisa

Indlela Yokuhlola

1. Isampula yebhodi noma ingxenye yebhodi ikhethwa ukuze ihlolwe.Usebenzisa isirinji ye-hypodermic, gcwalisa imbobo ngayinye ukuze uhlolwe ngamafutha acacile.Ukuze kuhlolwe ngempumelelo, kuyadingeka ukuthi amafutha enze i-meniscus ye-concave ebusweni bomgodi.Ifomu le-concave livumela ukubuka okubonakalayo kokuphelele okufakwe emgodini.Indlela elula yokwenza i-meniscus ye-concave ebusweni nokukhipha amafutha amaningi ukusebenzisa iphepha lokusula.Endabeni yanoma yikuphi ukufakwa komoya okukhona emgodini, amafutha engeziwe asetshenziswa kuze kube yilapho kutholakala umbono ocacile wendawo ephelele yangaphakathi.
2. Ibhodi lesampula lifakwe phezu komthombo wokukhanya;lokhu kuvumela ukukhanya kwe-plating ngokusebenzisa imbobo.Ibhokisi lokukhanya elilula noma isiteji esingaphansi esikhanyisiwe kusibonakhulu singanikeza ukukhanya okufanele.Usizo lokubuka olufanele luzodingeka ukuze kuhlolwe imbobo ngesikhathi sokuhlolwa.Ukuhlolwa okujwayelekile, ukukhuliswa okungu-5X kuzovumela ukubukwa kokwakheka kwebhamuza;ukuze kuhlolwe okuningiliziwe kwe- through hole, kufanele kusetshenziswe ukukhulisa okungu-25X.
3. Okulandelayo, phinda ugeleze i-solder ku-plated ngokusebenzisa izimbobo.Lokhu futhi kushisa endaweni yebhodi ezungezile.Indlela elula yokwenza lokhu ukufaka insimbi yokunamathisela enesihloko esihle endaweni yephedi ebhodini noma kumzila oxhuma endaweni ye-pad.Izinga lokushisa lethiphu lingahlukahluka, kodwa u-500°F ngokuvamile uyenelisa.Imbobo kufanele ihlolwe kanyekanye ngesikhathi sokusetshenziswa kwe-iron soldering.
4. Imizuzwana ngemva kokugeleza kabusha okuphelele kwethayela elifakwa emgodini, amabhamuza azobonakala ephuma kunoma iyiphi indawo encane noma enezimbotshana ekucwebeni.I-Outgassing ibonakala njengomfudlana oqhubekayo wamabhamuza, okubonisa izimbobo zokukhonkwane, imifantu, i-voids noma ukucwenga okuncane.Ngokuvamile uma ukukhishwa kwemali kubonakala, kuzoqhubeka isikhathi eside;ezimweni eziningi izoqhubeka kuze kukhishwe umthombo wokushisa.Lokhu kungase kuqhubeke imizuzu engu-1-2;kulezi zimo ukushisa kungase kubangele ukushintsha kombala kwezinto zebhodi.Ngokuvamile, ukuhlola kungenziwa phakathi kwamasekhondi angu-30 okusetshenziswa kokushisa kusekethe.
5. Ngemuva kokuhlolwa, ibhodi lingase lihlanzwe ku-solvent efanelekile ukuze kukhishwe amafutha asetshenziswe ngesikhathi sokuhlolwa.Ukuhlolwa kuvumela ukuhlolwa okusheshayo nangempumelelo kwengaphezulu lethusi noma ithini/i-lead plating.Ukuhlola kungase kusetshenziswe emigodini engenathayela/nomthofu;ezimweni zezinye izakhi eziphilayo, noma yikuphi ukubhuquza ngenxa yezingubo kuzophela phakathi nemizuzwana embalwa.Ukuhlolwa kuphinde kunikeze ithuba lokurekhoda imiphumela kokubili kuvidiyo noma ifilimu ukuze kuxoxwe ngayo esikhathini esizayo.

I-athikili nezithombe ezivela ku-inthanethi, uma kukhona ukwephulwa komthetho pls okokuqala xhumana nathi ukuze ukususe.
I-NeoDen ihlinzeka ngezixazululo ezigcwele zomugqa womhlangano we-SMT, okuhlanganisa i-oven reflow ye-SMT, umshini wokugcwalisa igagasi, umshini wokukhetha nendawo, iphrinta yokunamathisela i-solder, isilayishi se-PCB, isilayishi se-PCB, isikhuthazi se-chip, umshini we-SMT AOI, umshini we-SMT SPI, umshini we-SMT X-Ray, Imishini yomugqa we-SMT, Izisetshenziswa zokukhiqiza ze-PCB Izingxenye eziyisipele ze-SMT, njll.

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