Leli phepha libala amagama athile ajwayelekile ochwepheshe kanye nezincazelo zokucutshungulwa komugqa wokuhlanganisaUmshini we-SMT.
21. BGA
I-BGA imfushane kokuthi “I-Ball Grid Array”, okubhekisela kudivayisi yesekethe ehlanganisiwe lapho umkhondo wedivayisi uhlelwa khona ngendlela eyindilinga yegridi endaweni engaphansi yephakheji.
22. QA
I-QA ifushanisiwe ku-“Quality assurance”, isho ukuqinisekiswa kwekhwalithi.Kuumshini wokukhetha nokubekaukucubungula kuvame ukumelwa ukuhlolwa kwekhwalithi, ukuqinisekisa ikhwalithi.
23. Ukushisela okungenalutho
Alikho ithini phakathi kwephinikhodi yengxenye kanye nephedi ye-solder noma akukho ukuhlanganisa ezinye izizathu.
24.Gcwalisa kabusha IhhaviniUkushisela amanga
Inani lethayela phakathi kwephini lengxenye kanye nephedi ye-solder lincane kakhulu, elingaphansi kwezinga lokushisela.
25. ukushisela okubandayo
Ngemuva kokuthi unamathisele we-solder uphulukisiwe, kukhona okunamathiselwe kwezinhlayiyana ezingacacile ku-solder pad, engekho ezingeni lokushisela.
26. Izingxenye ezingalungile
Indawo engalungile yezingxenye ngenxa yephutha le-BOM, ECN, noma ezinye izizathu.
27. Izingxenye ezingekho
Uma ingekho ingxenye edayisiwe lapho ingxenye kufanele ithengiswe khona, ibizwa ngokuthi ilahlekile.
28. Ibhola le-tin slag tin
Ngemva kokushiselwa kwebhodi le-PCB, kunebhola le-tin slag eyengeziwe ngaphezulu.
29. Ukuhlolwa kwe-ICT
Thola isifunda esivulekile, isifunda esifushane kanye nokushisela kwazo zonke izingxenye ze-PCBA ngokuhlola indawo yokuhlola yokuxhumana ye-probe.Inezici zokusebenza okulula, indawo enephutha esheshayo nenembile
30. Ukuhlolwa kwe-FCT
Ukuhlolwa kwe-FCT kuvame ukubizwa ngokuthi ukuhlolwa kokusebenza.Ngokulingisa indawo yokusebenza, i-PCBA isezindaweni zemiklamo ehlukahlukene emsebenzini, ukuze ithole imingcele yesifunda ngasinye ukuze iqinisekise umsebenzi we-PCBA.
31. Ukuhlolwa kokuguga
Ukuhlolwa kokushiswa ukulingisa imiphumela yezinto ezihlukahlukene ku-PCBA ezingase zenzeke ezimweni zangempela zokusetshenziswa komkhiqizo.
32. Ukuhlolwa kokudlidliza
Ukuhlolwa kokudlidliza ukuhlola amandla e-anti-vibration ezingxenye ezilingisiwe, izingxenye eziyisipele nemikhiqizo yomshini ephelele endaweni esetshenziswayo, ezokuthutha nenqubo yokufaka.Ikhono lokunquma ukuthi umkhiqizo ungakwazi yini ukumelana nokundindizela okuhlukahlukene kwemvelo.
33. Umhlangano ophelile
Ngemva kokuphothulwa kokuhlolwa kwe-PCBA kanye negobolondo nezinye izakhi ziyahlanganiswa ukuze kwakhiwe umkhiqizo oqediwe.
34. I-IQC
I-IQC isifinyezo esithi “Ukulawula Ikhwalithi Engenayo”, ibhekisela ekuhlolweni Kwekhwalithi Engenayo, iyindawo yokugcina impahla yokuthenga Ukulawulwa Kwekhwalithi.
35. X - Ukutholwa kwe-ray
Ukungena kwe-X-ray kusetshenziselwa ukuthola ukwakheka kwangaphakathi kwezingxenye ze-elekthronikhi, i-BGA neminye imikhiqizo.Ingasetshenziswa futhi ukuthola ikhwalithi yokushisela yamalunga e-solder.
36. Mesh yensimbi
Imeshi yensimbi iyisikhunta esikhethekile se-SMT.Umsebenzi wawo oyinhloko ukusiza ekufakweni kwe-solder paste.Inhloso ukudlulisa inani eliqondile lokunamathisela kwe-solder endaweni eqondile ebhodini le-PCB.
37. isihluthulelo
I-Jigs yimikhiqizo edinga ukusetshenziswa ekukhiqizeni inqwaba.Ngosizo lokukhiqizwa kwama-jigs, izinkinga zokukhiqiza zingancishiswa kakhulu.Amajigi ngokuvamile ahlukaniswe abe izigaba ezintathu: amajigi omhlangano wenqubo, amajigi okuhlola amaphrojekthi kanye namajigi okuhlola ibhodi lesifunda.
38. IPQC
Ukulawulwa kwekhwalithi kunqubo yokukhiqiza ye-PCBA.
39. OQA
Ukuhlolwa kwekhwalithi yemikhiqizo eqediwe lapho iphuma efektri.
40. Ukuhlola ukwenziwa kwe-DFM
Lungiselela ukwakheka komkhiqizo nezimiso zokukhiqiza, inqubo kanye nokunemba kwezingxenye.Gwema izingozi zokukhiqiza.
Isikhathi sokuthumela: Jul-09-2021