Isivinini somhlangano
Umshini we-Wave soldering waziwa ngokwanda kokuphuma kwawo, ikakhulukazi uma uqhathaniswa nokuhlanganisa ngesandla.Le nqubo esheshayo ingase ibe inzuzo enkulu endaweni yokukhiqiza yevolumu ephezulu ye-PCB.Ngakolunye uhlangothi, isivinini somhlangano sisonke se-reflow soldering singase sihambe kancane.Nokho, lokhu kuncike inkimbinkimbi kanye nosayizi PCB, kanye izingxenye kokuba soldered.
Ukuhambisana kwengxenye
Yize umshini we-wave soldering ungasetshenziswa kuzo zombili izingxenye zembobo kanye ne-surface mount, imvamisa ifaneleka kakhulu kubuchwepheshe be- through-hole.Lokhu kungenxa yemvelo yenqubo ye-wave soldering, edinga ukuchayeka ku-solder encibilikisiwe.Umshini wokunamathisela ogelezayo uvame ukusetshenziswa kakhulu kubuchwepheshe bokukhweza phezulu njengoba usebenzisa indlela yokungaxhumani naye futhi ulungele izingxenye ezincane nezicolekileyo ku-SMT.
Ikhwalithi nokuthembeka
Ngenxa yokungathinteki kwemvelo ye-reflow soldering, inikeza ikhwalithi engcono ye-solder yezingxenye zokukhweza ngaphezulu.Lokhu kusiza ukunciphisa amathuba okulimala kwengxenye nokudala amabhuloho e-solder.Ngokuphambene, i-wave soldering ngezinye izikhathi ingakha amabhuloho e-solder, okungaholela kumasekhethi amafushane kanye nezinkinga ezingenzeka zikagesi.Ngaphezu kwalokho, i-wave soldering ingase ingasebenzi kahle ezicini zephimbo elihle njengoba kungase kube inselele ukuzuza imiphumela yokunamathisela enembile engaguquki.
Izici zezindleko
Izindleko zezinhlelo ze-wave kanye ne-reflow soldering zingahluka kakhulu kuye ngezici eziningana, okuhlanganisa ukutshalwa kwezimali kokuqala, ukugcinwa okuqhubekayo kanye nezindleko zezinto ezisetshenziswayo (i-solder, i-flux, njll.).Imishini ye-Wave soldering ivamise ukuba nezindleko eziphansi zokutshalwa kwezimali zokuqala, kanti okokusebenza kokugeleza kabusha kungabiza kakhulu.Izindleko zokunakekela kuzo zombili izinqubo kufanele futhi zicatshangelwe, nezinhlelo zokugeleza kabusha okungenzeka zidinga ukunakekelwa okuvame kakhulu ngenxa yobunkimbinkimbi bamathuluzi.Ukukhetha phakathi kwe-wave kanye ne-reflow soldering kufanele kusekelwe ekuhlaziyeni okuphelele kwezindleko zenzuzo, kucatshangelwa izidingo ezithile zenqubo yokukhiqiza, izidingo zevolumu kanye nohlobo lwezingxenye ezisetshenzisiwe.
Izici ze-NeoDen IN12C reflow oven
1. Isistimu yokuhlunga intuthu eyakhelwe ngaphakathi, ukuhlunga okusebenzayo kwamagesi ayingozi, ukubukeka okuhle nokuvikelwa kwemvelo, okuhambisana kakhulu nokusetshenziswa kwendawo ephezulu.
2. Uhlelo lokulawula lunezici zokuhlanganiswa okuphezulu, ukuphendula ngesikhathi, izinga lokuhluleka eliphansi, ukugcinwa okulula, njll.
3. Idizayini yemojula yokushisa eyingqayizivele, enokulawula okunemba okuphezulu kokushisa, izinga lokushisa elifanayoukusatshalaliswa endaweni yesinxephezelo esishisayo, ukusebenza kahle okuphezulu kwesinxephezelo esishisayo, ukusetshenziswa kwamandla okuphansi nezinye izici.
4. Ukusetshenziswa kwe-high-performance aluminium alloy heat plate esikhundleni se-tube yokushisa, kokubili ukonga amandla nokusebenza kahle, uma kuqhathaniswa namahhavini agelezayo afanayo emakethe, ukuchezuka kokushisa kwe-lateral kuncishiswe kakhulu.
5. Ukulawula okuhlakaniphile, inzwa yokushisa ezwela kakhulu, ukuzinza okusebenzayo kokushisa.
6. Ihlakaniphile, ihlanganiswe ne-PID yokulawula i-algorithm yesistimu yokulawula ehlakaniphile eyenziwe ngokwezifiso, kulula ukuyisebenzisa, inamandla.
7. Uhlelo lokuqapha izinga lokushisa kwebhodi le-Professional, eliyingqayizivele le-4-way board, ukuze ukusebenza kwangempela ngedatha yempendulo efika ngesikhathi nephelele, ngisho nemikhiqizo ye-elekthronikhi eyinkimbinkimbi isebenze.
Isikhathi sokuthumela: May-25-2023