Ukuhlelwa Kokukhubazeka Kwephakheji (I)

Amaphutha okupakisha ikakhulukazi ahlanganisa ukuguqulwa komthofu, i-base offset, i-warpage, ukuphuka kwe-chip, i-delamination, i-voids, ukupakishwa okungalingani, ama-burrs, izinhlayiya zangaphandle kanye nokwelapha okungaphelele, njll.

1. Ukuguqulwa komthofu

Ukuguqulwa komthofu ngokuvamile kubhekisela ekugudlukeni komthofu noma ukuguqulwa okubangelwa ngesikhathi sokugeleza kwe-plastic sealant, evame ukuvezwa ngesilinganiso x/L phakathi kwe-lateral lead displacement x nobude bokuhola L. Ukugoba komthofu kungaholela ezikhindini zikagesi (ikakhulukazi ekumineni okuphezulu kwedivayisi ye-I/O).Ngezinye izikhathi izingcindezi ezikhiqizwa ukugoba zingaholela ekuqhekekeni kwephuzu lokubopha noma ukunciphisa amandla ebhondi.

Izinto ezithinta isibopho somthofu zihlanganisa ukwakheka kwephakheji, ukwakheka komthofu, impahla eholayo nosayizi, izakhiwo zepulasitiki zokubumba, inqubo yokubopha okuholayo, nenqubo yokupakisha.Amapharamitha okuhola athinta ukugoba komthofu ahlanganisa ububanzi bomthofu, ubude bomthofu, umthwalo wekhefu lomthofu kanye nokuminyana komthofu, njll.

2. Isisekelo se-offset

I-Base offset isho ukuwohloka nokususwa kwenkampani yenethiwekhi (isisekelo se-chip) esisekela i-chip.

Izinto ezithinta ukuguqulwa kwesisekelo zifaka phakathi ukugeleza kwenhlanganisela yokubumba, idizayini yokuhlanganisa yozimele oholayo, kanye nezakhiwo ezibonakalayo zenhlanganisela yokubumba kanye nohlaka lomthofu.Amaphakheji afana ne-TSOP ne-TQFP asengozini yokuguquka kwesisekelo kanye nokuguqulwa kwephini ngenxa yozimele bazo abaholayo abancane.

3. I-Warpage

I-Warpage iwukugoba ngaphandle kwendiza kanye nokuguqulwa kwedivayisi yephakheji.I-Warpage ebangelwa inqubo yokubumba ingaholela ezinkingeni eziningi zokuthembeka ezifana ne-delamination kanye nokuqhekeka kwe-chip.

I-Warpage ingase futhi iholele ezinhlobonhlobo zezinkinga zokukhiqiza, njengakumadivayisi e-plasticized ball grid array (PBGA), lapho i-warpage ingase iholele ku-coplanarity yebhola le-solder elimpofu, okubangela izinkinga zokubeka ngesikhathi sokugeleza kabusha kwedivayisi ukuze ihlanganiswe ebhodini lesifunda eliphrintiwe.

Amaphethini e-warpage ahlanganisa izinhlobo ezintathu zamaphethini: i-concave yangaphakathi, i-convex yangaphandle futhi ihlangene.Ezinkampanini ze-semiconductor, i-concave ngezinye izikhathi ibizwa ngokuthi "ubuso obumomothekayo" futhi i-convex ngokuthi "ubuso obukhalayo".Izimbangela eziyinhloko ze-warpage zifaka ukungafani kwe-CTE kanye nokuncipha kokwelapha/ukucindezela.Laba bamuva abazange bathole ukunakwa okuningi ekuqaleni, kodwa ucwaningo olunzulu lwembula ukuthi ukushwabana kwamakhemikhali kwenhlanganisela yokubumba nakho kudlala indima ebalulekile ku-warpage yedivayisi ye-IC, ikakhulukazi kumaphakheji anobukhulu obuhlukahlukene phezulu nangaphansi kwe-chip.

Ngesikhathi sokuphulukisa kanye nenqubo yokuphulukisa, i-compound yokubumba izobhekana nokuncipha kwamakhemikhali ekushiseni okuphezulu kokuphulukisa, okubizwa ngokuthi "i-thermochemical shrinkage".Ukuncipha kwamakhemikhali okwenzeka ngesikhathi sokwelashwa kungancishiswa ngokukhuphula izinga lokushisa lokushintsha kwengilazi nokunciphisa ushintsho ku-coefficient yokwanda okushisayo okuzungeze i-Tg.

I-Warpage ingabuye ibangelwe yizici ezifana nokubunjwa kwenhlanganisela yokubumba, umswakama ku-compound yokubumba, kanye nejometri yephakheji.Ngokulawula izinto ezibunjwayo kanye nokwakheka, imingcele yenqubo, isakhiwo sephakheji kanye nemvelo yangaphambi kwe-encapsulation, i-warpage yephakheji ingancishiswa.Kwezinye izimo, i-warpage inganxeshezelwa ngokuhlanganisa uhlangothi olungemuva lwe-electronic assembly.Isibonelo, uma ukuxhumeka kwangaphandle kwebhodi le-ceramic elikhulu noma ibhodi le-multilayer likuhlangothi olulodwa, ukuzifaka ohlangothini olungemuva kunganciphisa i-warpage.

4. Ukuphuka kwe-chip

Izingcindezi ezikhiqizwa inqubo yokupakisha zingaholela ekuqhekekeni kwe-chip.Inqubo yokupakisha imvamisa yenza kube kubi kakhulu imifantu emincane eyenziwe enqubweni yokuhlanganisa edlule.I-wafer noma i-chip thinning, ukugaya ngemuva, kanye ne-chip bonding yizinyathelo ezingaholela ekuhlumeni kwemifantu.

I-chip ephukile, ehlulekile ngokomshini ayiholeli ngempela ekuhlulekeni kukagesi.Ukuthi ukugqashuka kwe-chip kuzoholela ekuhlulekeni kogesi ngokushesha kwedivayisi nakho kuncike endleleni yokukhula kwe-crack.Isibonelo, uma ukuqhekeka kuvela ngemuva kwe-chip, kungase kungathinti noma yiziphi izakhiwo ezibucayi.

Ngenxa yokuthi ama-wafer e-silicon mancane futhi ayaphuka, ukupakishwa kweleveli ye-wafer kulula kakhulu ekuqhumeni kwe-chip.Ngakho-ke, amapharamitha okucubungula afana nokucindezela kokubopha kanye nokucindezela kokuguquguquka kokubumba kunqubo yokubumba yokudlulisa kumele ilawulwe ngokuqinile ukuze kuvinjelwe ukuphuka kwe-chip.Amaphakheji astakiwe e-3D athambekele ekuqhekekeni kwe-chip ngenxa yenqubo yokupakisha.Izici zokuklama ezithinta ukuphuka kwe-chip kumaphakheji e-3D zifaka ukwakheka kwesitaki se-chip, ukujiya kwe-substrate, ivolumu yokubumba kanye nogqinsi lwemikhono yesikhunta, njll.