1. I-PBGA iqoqwe ku-Umshini we-SMT, futhi inqubo dehumidification ayenziwa ngaphambi Welding, okuholela ekulimaleni PBGA ngesikhathi Welding.
Amafomu okupakisha e-SMD: amaphakheji angangeni moya, okuhlanganisa ukupakishwa kwepulasitiki okugoqa ibhodwe kanye ne-epoxy resin, ukupakishwa kwe-silicone resin (kuchayeke emoyeni ozungezile, izinto ze-polymer ezivuvukala umswakama).Wonke amaphakheji epulasitiki amunca umswakama futhi awavalwanga ngokuphelele.
Lapho i-MSD ivezwa endaweni ephakemereflow ovenimvelo yokushisa, ngenxa yokungeniswa komswakama wangaphakathi we-MSD ukuze uhwamuke ukuze ukhiqize ingcindezi eyanele, yenza ibhokisi lepulasitiki lokupakisha lisuka ku-chip noma iphinikhodi elendlalwe futhi liholele ekuxhumeni ukulimala kwama-chips kanye nokuqhekeka kwangaphakathi, ezimweni ezimbi kakhulu, ukuqhekeka kudlulela ebusweni be-MSD. , ibangele ngisho nebhaluni ye-MSD futhi iqhume, eyaziwa ngele-“popcorn” phenomenon.
Ngemva kokuchayeka emoyeni isikhathi eside, umswakamo osemoyeni usakazeka engxenyeni yokupakisha engenekayo.
Ekuqaleni kwe-reflow soldering, lapho izinga lokushisa lingaphezulu kuka-100℃, umswakama ongaphezulu wezingxenye uyanda kancane kancane, futhi amanzi aqoqeka kancane kancane engxenyeni yokubopha.
Ngesikhathi senqubo ye-surface mount welding, i-SMD ivezwa emazingeni okushisa angaphezu kuka-200 ℃.Ngesikhathi sokugeleza kabusha kwezinga lokushisa eliphezulu, inhlanganisela yezinto ezifana nokunwetshwa komswakama okusheshayo ezingxenyeni ezithile, ukungafani kwezinto ezibonakalayo, kanye nokuwohloka kokuxhumana okubalulekile kungaholela ekuqhekekeni kwamaphakheji noma ekudambiseni ezindaweni ezibalulekile zangaphakathi.
2. Lapho welding izingxenye umthofu-free ezifana PBGA, lo mkhuba MSD "popcorn" ekukhiqizeni izoba kaningi futhi sína ngenxa yokwanda kwezinga lokushisa Welding, futhi ngisho kuholele ekukhiqizeni ayikwazi evamile.
Isikhathi sokuthumela: Aug-12-2021