Isendlalelo esingaphansi noma esimaphakathi siyingxenye ebaluleke kakhulu yephakheji ye-BGA, engasetshenziselwa ukulawula i-impedance kanye nokuhlanganiswa kwe-inductor/resistor/capacitor ngaphezu kokuxhuma izintambo.Ngakho-ke, i-substrate material iyadingeka ukuthi ibe nezinga lokushisa eliphezulu le-glass transition rS (cishe 175~230℃), ukuzinza kwe-dimensional ephezulu kanye nokumunca umswakama ophansi, ukusebenza kahle kukagesi nokuthembeka okuphezulu.Ifilimu yensimbi, isendlalelo sokufakelwa kanye nemidiya ye-substrate kufanele futhi ibe nezindawo zokunamathela eziphezulu phakathi kwazo.
1. Inqubo yokupakisha ye-PBGA eboshwe ngomthofu
① Ukulungiswa kwe-PBGA substrate
Laminate izacile kakhulu (ugqinsi oluyi-12~18μm) ezinhlangothini zombili ze-BT resin/glass core board, bese ubhoboza izimbobo kanye nokuphuma kwensimbi ngembobo.Inqubo evamile ye-PCB plus 3232 isetshenziselwa ukudala izithombe ezinhlangothini zombili ze-substrate, njengemicu engumhlahlandlela, ama-electrode, kanye nezindawo ze-solder zokukhweza amabhola e-solder.Imaski ye-solder ibe yengezwa futhi ihluzo zenziwa ukuze kuvezwe ama-electrode nezindawo ze-solder.Ukuze uthuthukise ukusebenza kahle kokukhiqiza, i-substrate ngokuvamile iqukethe ama-PBG substrates amaningi.
② Ukuhamba Kwenqubo Yokupakisha
I-wafer thinning → ukusika i-wafer → i-chip bonding → ukuhlanzwa kwe-plasma → i-lead bonding → ukuhlanzwa kwe-plasma → iphakheji elibunjiwe → ukuhlanganiswa kwamabhola e-solder → ukuphinda kufakwe i-oven soldering → ukumakwa kwendawo → ukuhlukaniswa → ukuhlolwa kokugcina → ukupakishwa kwe-hopper yokuhlola
Isibopho se-chip sisebenzisa i-epoxy enamathelayo egcwele isiliva ukuhlanganisa i-IC chip ku-substrate, bese kusetshenziswa intambo yegolide ukuze kubonakale ukuxhumana phakathi kwe-chip ne-substrate, kulandelwe i-encapsulation yepulasitiki ebunjiwe noma i-adhesive potting ukuvikela i-chip, imigqa ye-solder. kanye namaphedi.Ithuluzi lokuqoqa eliklanywe ngokukhethekile lisetshenziselwa ukubeka amabhola e-solder angu-62/36/2Sn/Pb/Ag noma 63/37/Sn/Pb anephuzu lokuncibilika elingu-183°C nobubanzi obungu-30 mil (0.75mm) amaphedi, kanye ne-reflow soldering yenziwa kuhhavini ogelezayo ojwayelekile, onezinga lokushisa eliphakeme lokucubungula elingekho ngaphezu kuka-230°C.I-substrate ibe ihlanzwa ngokumaphakathi nge-CFC inorganic cleaner ukuze kukhishwe izinhlayiya ze-solder nefiber ezisele ephaketheni, kulandelwe ukumaka, ukuhlukaniswa, ukuhlolwa kokugcina, ukuhlolwa, kanye nokupakishwa ukuze kugcinwe.Okungenhla kuyinqubo yokupakisha yohlobo lokubopha umthofu PBGA.
2. Inqubo yokupakisha ye-FC-CBGA
① I-Ceramic substrate
I-substrate ye-FC-CBGA iyi-multilayer ceramic substrate, okunzima kakhulu ukuyenza.Ngoba i-substrate inobuningi bezintambo eziphakeme, izikhala ezincane, futhi eziningi ngokusebenzisa izimbobo, kanye nemfuneko ye-coplanarity ye-substrate iphezulu.Inqubo yayo eyinhloko: okokuqala, amashidi e-ceramic multilayer ahlanganiswa ekushiseni okuphezulu ukuze enze i-multilayer ceramic metallized substrate, khona-ke i-wiring yensimbi ye-multilayer yenziwa ku-substrate, bese i-plating yenziwa, njll. Emhlanganweni we-CBGA , ukungafani kwe-CTE phakathi kwe-substrate ne-chip kanye nebhodi le-PCB kuyisici esiyinhloko esibangela ukwehluleka kwemikhiqizo ye-CBGA.Ukuthuthukisa lesi simo, ngaphezu kwesakhiwo se-CCGA, enye i-substrate ye-ceramic, i-HITCE ye-ceramic substrate, ingasetshenziswa.
②Ukuhamba kwenqubo yokupakisha
Ukulungiswa kwama-disc bumps -> i-disc cutting -> i-chip flip-flop kanye ne-reflow soldering -> ukugcwaliswa phansi kwamafutha ashisayo, ukusatshalaliswa kwe-solder yokuvala -> i-capping -> ukuhlanganiswa kwamabhola e-solder -> i-reflow soldering -> ukumaka -> ukuhlukaniswa -> ukuhlolwa kokugcina -> ukuhlolwa -> ukupakisha
3. Inqubo yokupakisha ye-TBGA yokubopha ngomthofu
① Itheyiphu yenkampani yenethiwekhi ye-TBGA
Itheyiphu yokuthwala ye-TBGA ivamise ukwenziwa ngezinto ze-polyimide.
Emkhiqizweni, izinhlangothi zombili zetheyiphu ethwalayo ziqala zimbozwa ngethusi, bese kuba i-nickel negolide, kulandelwe ukubhoboza ngembobo kanye ne- through-hole metallization kanye nokukhiqizwa kwezithombe.Ngenxa yokuthi kule TBGA eboshiwe yomthofu, usinki wokushisa ovalekile ubuye ube yi-substrate ehlanganisiwe eqinile futhi ewumgogodla wegobolondo leshubhu, ngakho-ke itheyipu yokuthwala iboshelwa kusinki yokushisa kusetshenziswa okunamathelayo okuzwela ukucindezela ngaphambi kokuhlanganisa.
② Ukugeleza kwenqubo ye-encapsulation
Ukunciphisa i-chip → ukusika i-chip → ukubopha kwe-chip → ukuhlanza → ukubopha ngomthofu → ukuhlanzwa kwe-plasma → imbiza ye-sealant ewuketshezi → ukuhlanganisa amabhola oda → ukuphinda kuhlanganiswe → ukumaka ebusweni → ukuhlukanisa → ukuhlola kokugcina → ukuhlola → ukupakisha
I-Zhejiang NeoDen Technology Co., LTD., eyasungulwa ngo-2010, ingumkhiqizi ochwepheshe okhethekile emshinini wokukhetha nendawo we-SMT, ihhavini eligeleza kabusha, umshini wokuphrinta we-stencil, ulayini wokukhiqiza we-SMT neminye Imikhiqizo ye-SMT.
Sikholelwa ukuthi abantu abakhulu nozakwethu benza i-NeoDen inkampani enhle futhi ukuzibophezela kwethu Ekusunguleni, Ukuhlukahluka kanye Nokusimama kuqinisekisa ukuthi i-SMT automation ifinyeleleka kuwo wonke umuntu wokuzilibazisa kuyo yonke indawo.
Engeza: No.18, Tianzihu Avenue, Tianzihu Town, Anji County, Huzhou City, Zhejiang Province, China
Ucingo: 86-571-26266266
Isikhathi sokuthumela: Feb-09-2023