Ukufakwa kwe-Anti-deformation yezingxenye zebhodi lesifunda eliphrintiwe

1. Kuhlaka lokuqinisa kanye nokufakwa kwe-PCBA, i-PCBA kanye nenqubo yokufaka i-chassis, i-PCBA esontiwe noma ukuqaliswa kohlaka lokuqinisa olusontekile lokufakwa okuqondile noma okuphoqelelwe kanye nokufakwa kwe-PCBA ku-chassis ekhubazekile.Ingcindezi yokufaka idala umonakalo kanye nokuqhekeka kwezingxenye ezihamba phambili (ikakhulukazi ama-IC aminyana kakhulu njenge-BGS nezinto zokukhweza ngaphezulu), izimbobo zokudlulisa ama-PCB anezingqimba eziningi kanye nemigqa yokuxhumana yangaphakathi namaphedi ama-PCB anezingqimba eziningi.Ekhasini le-warpage alihlangabezani nezimfuneko ze-PCBA noma uhlaka oluqinisiwe, umklami kufanele abambisane nochwepheshe ngaphambi kokufakwa ezingxenyeni zayo eziwumnsalo (ezisontekile) ukuze athathe noma aklame izinyathelo ezisebenzayo “zephedi”.

2. Ukuhlaziya

a.Phakathi kwezingxenye ze-chip capacitive, amathuba okuba neziphambeko kuma-ceramic chip capacitors aphakeme kakhulu, ikakhulukazi alandelayo.

b.Ukukhothama kwe-PCBA nokuguqulwa okubangelwa ingcindezi yokufakwa kwenqwaba yezintambo.

c.I-Flatness ye-PCBA ngemuva kokudayiswa kukhulu kuno-0.75%.

d.Idizayini ye-asymmetric yamaphedi kuzo zombili iziphetho zama-ceramic chip capacitors.

e.Amaphedi asetshenziswayo anesikhathi sokudambisa esikhulu kuno-2s, izinga lokushisa elingaphezulu kuka-245℃, kanye nenani eliphelele lezikhathi zokuhlanganisa ezedlula inani elishiwo izikhathi eziyisi-6.

f.I-coefficient ehlukile yokwandisa okushisayo phakathi kwe-ceramic chip capacitor nezinto ze-PCB.

g.Idizayini ye-PCB enezimbobo zokulungisa nama-ceramic chip capacitor asondelene kakhulu abangela ingcindezi lapho kuqiniswa, njll.

h.Ngisho noma i-ceramic chip capacitor inosayizi ofanayo wephedi ku-PCB, uma inani le-solder liningi kakhulu, lizokwandisa ukucindezeleka kwe-chip capacitor lapho i-PCB igobile;inani elifanele le-solder kufanele libe ngu-1/2 kuya ku-2/3 wobude bokuphela kwe-solder ye-chip capacitor

i.Noma yikuphi ukucindezeleka kwangaphandle komshini noma okushisayo kuzodala imifantu kuma-ceramic chip capacitors.

• Imifantu edalwe ukukhishwa kwekhanda lokukhwezwa kanye nendawo izovela ebusweni bengxenye, ngokuvamile njengokuqhekeka okumise okuyisiyingi noma okuyingxenye yenyanga nokushintsha kombala, phakathi noma eduze kwamaphakathi ne-capacitor.
• Ukuqhekeka okubangelwa izilungiselelo ezingalungile ze-umshini wokukhetha nokubekaimingcele.Inhloko yesikhweli sisebenzisa ishubhu yokudonsa ivacuum noma isigxivizo esiphakathi nendawo ukuze imise ingxenye, futhi ukucindezela okweqile kwe-Z-axis okuya phansi kungaphula ingxenye yobumba.Uma amandla amakhulu anele asetshenziswa ekukhetheni nasekubekeni ikhanda endaweni ngaphandle kwendawo emaphakathi yomzimba we-ceramic, ukucindezeleka okufakwe ku-capacitor kungase kube kukhulu ngokwanele ukulimaza ingxenye.
• Ukukhetha okungalungile kosayizi we-chip pick nekhanda lendawo kungabangela ukuqhekeka.I-diameter encane yokukhetha nendawo izogxilisa amandla okubeka ngesikhathi sokubekwa, okubangele indawo encane ye-ceramic chip capacitor ukuthi ibe ngaphansi kwengcindezi enkulu, okuholela ekuqhekekeni kwama-chip capacitor e-ceramic.
• Inani elingahambisani ne-solder lizokhiqiza ukusabalalisa kokucindezeleka okungahambisani nengxenye, futhi ekugcineni kuzogcizelela ukugxila nokuqhekeka.
• Imbangela eyinhloko yokuqhekeka i-porosity kanye nokuqhekeka phakathi kwezingqimba ze-ceramic chip capacitors kanye ne-ceramic chip.

3. Izinyathelo zokuxazulula.

Qinisa ukuhlolwa kwama-ceramic chip capacitor:Ama-chip capacitor e-ceramic ahlolwa nge-C-type scanning acoustic microscope (C-SAM) kanye ne-laser acoustic microscope (SLAM) yokuskena (SLAM), engahlola ama-capacitor e-ceramic angalungile.