1. izinga lokushisa lokushisa elingafaneleki.Izinga lokushisa eliphansi kakhulu lizobangela ukungasebenzi kahle kwe-flux noma ibhodi le-PCB kanye nezinga lokushisa elinganele, okuholela emazingeni okushisa ethini anganele, ukuze amandla okumanzisa i-solder kanye ne-fluidity iba mpofu, imigqa eseduze phakathi kwebhuloho elihlangene le-solder.
2. Ukushisa kwe-Flux preheat kuphezulu kakhulu noma kuphansi kakhulu, ngokuvamile ku-100 ~ 110 degrees, ukushisa kuqala kuphansi kakhulu, umsebenzi we-flux awuphezulu.Ukushisa kuphezulu kakhulu, ku-tin steel flux akusekho, kodwa futhi kulula ngisho nokufaka ithini.
3. Akukho ukugeleza noma ukugeleza akwanele noma ukungalingani, ukungezwani okungaphezulu kwesimo esincibilikisiwe sikathini akukhululiwe, okuholela ekubeni kube lula ngisho ukuthayela.
4. Hlola izinga lokushisa kwesithando somlilo, usilawule cishe ngama-degree angu-265, kungcono ukusebenzisa i-thermometer ukukala izinga lokushisa lamagagasi lapho igagasi lidlalwa phezulu, ngoba inzwa yokushisa yemishini ingase ibe phansi. yesithando somlilo noma ezinye izindawo.Ukushisa okunganele kokushisa ngaphambi kokushisa kuzoholela ezingxenyeni ezingakwazi ukufinyelela izinga lokushisa, inqubo yokushisela ngenxa yokumuncwa kokushisa kwengxenye, okuholela ekudonseni okumpofu kwe-tin, nokwakheka kwe-tin ngisho;kungase kube nezinga lokushisa eliphansi lesithando sethayela, noma isivinini sokushisela sishesha kakhulu.
5. Indlela yokusebenza engalungile uma isandla sicwilisa ithini.
6. ukuhlolwa njalo ukwenza ukwakheka tin analysis, kungase kube khona ithusi noma okunye okuqukethwe metal idlula izinga, okuholela tin ukuhamba kuncipha, kulula ukubangela ngisho tin.
7. i-solder engcolile, i-solder ekungcoleni okuhlanganisiwe idlula izinga elivumelekile, izici ze-solder zizoshintsha, ukumanzisa noma ukugeleza kwamanzi kancane kancane kuzoba kubi kakhulu, uma okuqukethwe kwe-antimony engaphezu kuka-1.0%, i-arsenic engaphezu kuka-0.2%, ihlukaniswe ngaphezu I-0.15%, i-fluidity ye-solder izokwehla ngo-25%, kuyilapho okuqukethwe kwe-arsenic engaphansi kuka-0.005% kuzosusa ukumanzisa.
8. hlola i-wave soldering track angle, amadigri angu-7 angcono kakhulu, ayisicaba kakhulu kulula ukulenga ithini.
9. PCB ibhodi deformation, lesi simo kuzoholela PCB kwesokunxele maphakathi kwesokudla ezintathu ingcindezi wave ukujula ukungavumelani, futhi okubangelwa ukudla tin indawo ejulile ukugeleza tin abushelelezi, kulula ukukhiqiza ibhuloho.
10. I-IC kanye nomugqa womklamo omubi, kuhlanganiswe, izinhlangothi ezine ze-IC eziminyene ezinyaweni zesikhala esingu-<0.4mm, ayikho i-engeli etshekile ebhodini.
11.pcb evuthayo maphakathi usinki deformation okubangelwa ngisho tin.
12. I-PCB board welding angle, ngokusobala i-engeli enkulu, amalunga e-solder ku-wave evela kumagagasi ngaphambi nangemva kwamalunga e-solder asuka kugagasi lapho amathuba okuba indawo evamile emancane, amathuba ebhuloho nawo mancane.Kodwa-ke, i-angle ye-soldering inqunywa izici zokumanzisa ze-solder ngokwayo.Ngokuvamile, i-engeli ye-lead soldering iyalungiseka phakathi kuka-4° no-9° kuye ngedizayini ye-PCB, kuyilapho i-engeli engenamthofu ilungiseka phakathi kuka-4° no-6° kuye ngedizayini ye-PCB yekhasimende.Kufanele kuqashelwe ukuthi engxenyeni enkulu yenqubo yokushisela, ingaphambili le-PCB dip tin lizobonakala lidla ithini ekuntulekeni kwe-tin esimweni, okubangelwa ukushisa kwebhodi le-PCB phakathi nendawo. i-concave, uma isimo esinjalo kufanele sifanele ukunciphisa i-angle yokushisela.
13. phakathi pads wesifunda ibhodi kungukuthi yakhelwe ukumelana solder dam, ngemva ukunyathelisa on the unama solder exhunywe;noma ibhodi lesifunda ngokwayo yakhelwe ukumelana solder dam / ibhuloho, kodwa umkhiqizo osuphelile ibe ingxenye noma zonke off, ke futhi kulula ngisho tin.
Isikhathi sokuthumela: Nov-02-2022