Iziteshi zokuvuselela kabusha ze-SMT zingahlukaniswa zibe izinhlobo ezi-4 ngokuya ngokwakhiwa kwazo, ukusetshenziswa kwazo nokuba yinkimbinkimbi: uhlobo olulula, uhlobo oluyinkimbinkimbi, uhlobo lwe-infrared kanye nohlobo lomoya oshisayo we-infrared.
1. Uhlobo olulula: lolu hlobo lwemishini yokusebenza kabusha luvame kakhulu kunokusebenza kwethuluzi lensimbi elizimele, lingakhetha ukusebenzisa imininingwane ehlukene yekhanda lensimbi ngokuya ngokucaciswa kwengxenye, ingxenye yesistimu kanye neplatifomu yokusebenza ye-PCB engaguquki, ikakhulukazi imbobo. Ukushisa kwengxenye, i-chip soldering nokususwa kwe-chip, njll.
2. Uhlobo oluyinkimbinkimbi: uhlobo oluyinkimbinkimbi lwemishini yokusebenza kabusha kanye nemishini elula yokulungisa kabusha, uma kuqhathaniswa nakho kokubili kungahlukanisa izingxenye, unamathisele we-solder onamabala, izingxenye ezifakwayo kanye nezingxenye zokushisela, okubaluleke kakhulu uhlelo lokubeka isithombe, uhlelo lokulawula izinga lokushisa, ukumuncwa kwe-vacuum okulawulwayo kanye uhlelo lokukhulula, njll. Lolu hlobo lwesisetshenziswa ngokuyinhloko lunomshini wokusebenza kabusha we-GOOT,Isiteshi sokusebenza kabusha se-BGA, njll.
3. Uhlobo lwe-infrared: umshini wokusebenza kabusha wohlobo lwe-infrared ikakhulukazi ukusetshenziswa komphumela wokushisa we-infrared radiation ukuqedela ukuphinda kusetshenzwe kabusha izingxenye, umphumela wokushisa we-infrared radiation unokufana, akukho mkhuba wokupholisa wasendaweni okwenzeka lapho ukufudumeza komoya oshisayo, ukufudumala kwangaphambi kwesikhathi kuhamba kancane, ukufudumala sekwephuzile ngokushesha, ukungena kunamandla kuqhathaniswa, kodwa kabusha izikhathi eziningana ibhodi PCB kulula ukubangela delamination ngokusebenzisa imbobo akusebenzi.
4. Uhlobo lomoya oshisayo oyi-infrared: okokusebenza kabusha kohlobo lomoya oshisayo we-infrared ngokusebenzisa inhlanganisela ye-infrared ne-thermal sub heat ukuze kusetshenziswe kabusha, kugxilwe izinzuzo ze-infrared kanye nemishini yokuvuselela umoya oshisayo.Uma usebenzisa ukufudumeza okugcwele kwe-infrared okuqhubekayo, kulula ukuholela ekungazinzini kwezinga lokushisa, indawo yokushisa ye-infrared izoba nkulu ngokuqhathaniswa, khona-ke ezinye zebhodi le-potting uma zingavikelwe, ingabe i-BGA izoholela ekuqhumeni kwe-chip ezungezile, njengokulungisa i-laptop ngokuvamile. hhayi ukushisa okugcwele kwe-infrared, kodwa ukusetshenziswa kwenhlanganisela yokushisa komoya oshisayo we-infrared.
Izici zeI-NeoDenIsiteshi sokusebenza kabusha se-BGA
Ukunikezwa kwamandla: AC220V±10%, 50/60HZ
Amandla: 5.65KW(Max),I-heater ephezulu (1.45KW)
Isishicileli esingaphansi (1.2KW), IR Preheater (2.7KW), Okunye(0.3KW)
PCB Usayizi: 412*370mm(Max); 6*6mm(Min)
I-BGA Chip Usayizi: 60*60mm(Max); 2*2mm(Min)
IR heater Usayizi: 285 * 375mm
Inzwa yokushisa: 1 pcs
Indlela yokusebenza: 7″ isikrini sokuthinta se-HD
Uhlelo Lokulawula: Isistimu yokulawula ukushisa okuzenzakalelayo V2 (i-software copyright)
Isistimu yokubonisa: 15″ SD isibonisi sezimboni (720P isikrini sangaphambili)
Uhlelo Lokuqondanisa: I-2 Million Pixel SD imaging system yedijithali, ukusondeza okuzenzakalelayo kokubona ngelaser: inkomba yamachashazi abomvu
I-Vacuum Adsorption: Okuzenzakalelayo
Ukunemba Kokuqondanisa: ±0.02mm
Ukulawula izinga lokushisa: Ukulawulwa kwe-thermocouple kohlobo lwe-K-loop oluvaliwe ngokunemba kufika ku-±3℃
Idivayisi yokudla: Cha
Ukuma: I-V-groove ene-universal fixture
Isikhathi sokuthumela: Dec-09-2022