Amaphuzu olwazi angu-110 wokucubungula i-chip ye-SMT - Ingxenye 1
1. Ngokuvamile, izinga lokushisa le-SMT chip processing workshop lingu-25 ± 3 ℃;
2. Izinto kanye nezinto ezidingekayo ukuze kunyatheliswe i-solder paste, njenge-solder paste, i-steel plate, i-scraper, iphepha lokusula, iphepha elingenalo uthuli, okokuhlanza kanye nommese wokuxuba;
3. Ukwakheka okuvamile kwe-solder paste alloy yi-Sn / Pb alloy, kanti isabelo se-alloy singama-63/37;
4. Kunezingxenye ezimbili eziyinhloko ku-solder paste, ezinye ziyi-tin powder kanye ne-flux.
5. Indima eyinhloko ye-flux ekushiseleni ukukhipha i-oxide, ukulimaza ukungezwani kwangaphandle kwe-tin encibilikisiwe futhi kugwenywe ukukhishwa kabusha.
6. Isilinganiso sevolumu yezinhlayiya ze-tin powder ukuze zigeleze cishe ngu-1: 1 futhi isilinganiso sengxenye simayelana ne-9: 1;
7. Umgomo we-solder unama kuqala kuqala;
8. Uma i-solder paste isetshenziswa e-Kaifeng, kufanele ifudumale futhi ixube ngezinqubo ezimbili ezibalulekile;
9. Izindlela ezijwayelekile zokukhiqiza ipuleti lensimbi yilezi: i-etching, i-laser kanye ne-electroforming;
10. Igama eligcwele lokucubungula i-chip ye-SMT ubuchwepheshe bokukhweza (noma ukukhwezwa), okusho ubuchwepheshe bokunamathela kokubukeka (noma ukukhwezwa) ngesiShayina;
11. Igama eligcwele le-ESD i-electro static discharge, okusho ukukhishwa kwe-electrostatic ngesiShayina;
12. Lapho kukhiqizwa uhlelo lwemishini ye-SMT, uhlelo luhlanganisa izingxenye ezinhlanu: idatha ye-PCB;phawula idatha;idatha yokuphakelayo;idatha ye-puzzle;ingxenye yedatha;
13. Iphuzu lokuncibilika lika-Sn / Ag / Cu 96.5 / 3.0 / 0.5 ngu-217c;
14. Izinga lokushisa elihlobene nokusebenza okuhambisanayo kanye nomswakama wezingxenye ze-ovini omisiwe ngu-< 10%;
15. Imishini ye-passive evame ukusetshenziswa ihlanganisa ukumelana, i-capacitance, i-point inductance (noma i-diode), njll.;amadivayisi asebenzayo ahlanganisa ama-transistors, i-IC, njll;
16. Impahla eluhlaza ye-SMT steel plate evame ukusetshenziswa iyinsimbi engagqwali;
17. Ubukhulu be-SMT steel plate evame ukusetshenziswa ngu-0.15mm (noma 0.12mm);
18. Izinhlobonhlobo zokushaja kwe-electrostatic zifaka ukungqubuzana, ukuhlukaniswa, ukungeniswa, ukuqhutshwa kwe-electrostatic, njll.;umthelela we-electrostatic charge embonini ye-elekthronikhi ukwehluleka kwe-ESD kanye nokungcoliswa kwe-electrostatic;Izimiso ezintathu zokuqedwa kwe-electrostatic i-electrostatic neutralization, ukubeka phansi kanye nokuvikela.
19. Ubude x ububanzi besistimu yesiNgisi bungu-0603 = 0.06inch * 0.03inch, futhi lolo lwesistimu yemethrikhi ngu-3216 = 3.2mm * 1.6mm;
20. Ikhodi 8 “4″ ye-erb-05604-j81 ikhombisa ukuthi kukhona amasekhethi angu-4, futhi inani lokumelana lingu-56 ohm.Amandla we-eca-0105y-m31 yi-C = 106pf = 1NF = 1×10-6f;
21. Igama eliphelele lesiShayina le-ECN yisaziso soshintsho lobunjiniyela;igama eliphelele lesiShayina le-SWR lithi: i-oda lomsebenzi elinezidingo ezikhethekile, okudingeka ukuthi zisayinwe yiminyango efanele futhi zisatshalaliswe phakathi, okuwusizo;
22. Okuqukethwe okuqondile kwe-5S ukuhlanza, ukuhlunga, ukuhlanza, ukuhlanza kanye nekhwalithi;
23. Inhloso ye-PCB vacuum packaging ukuvimbela uthuli kanye nomswakama;
24. Inqubomgomo yekhwalithi ithi: konke ukulawulwa kwekhwalithi, landela imibandela, unikeze ikhwalithi edingwa amakhasimende;umgomo wokubamba iqhaza okugcwele, ukuphatha ngesikhathi, ukuze kuzuzwe i-zero sici;
25. Izinqubomgomo ezintathu zokungabi nakhwalithi yilezi: ukungamukelwa kwemikhiqizo enesici, ukukhiqizwa kwemikhiqizo enesici kanye nokungaphumi kwemikhiqizo enesici;
26. Phakathi kwezindlela eziyisikhombisa ze-QC, i-4m1h ibhekisela ku (isiShayina): umuntu, umshini, impahla, indlela kanye nemvelo;
27. Ukwakheka kwe-solder paste kuhlanganisa: impushana yensimbi, i-Rongji, i-flux, i-anti vertical flow agent kanye ne-ejenti esebenzayo;ngokwengxenye, i-powder yensimbi ibalelwa ku-85-92%, kanti ivolumu ebalulekile ye-powder yensimbi ibalelwa ku-50%;phakathi kwazo, izingxenye eziyinhloko ze-powder yensimbi ziyi-tin nomthofu, isabelo singu-63/37, futhi iphuzu lokuncibilika liyi-183 ℃;
28. Uma usebenzisa i-solder paste, kuyadingeka ukuyikhipha esiqandisini ukuze ululame izinga lokushisa.Inhloso ukwenza izinga lokushisa lokunamathisela kwe-solder libuyele ekushiseni okujwayelekile ukuze liphrintwe.Uma izinga lokushisa lingabuyiswa, i-solder bead kulula ukwenzeka ngemva kokuba i-PCBA ingena kabusha;
29. Amafomu okunikezwa kwedokhumenti omshini ahlanganisa: ifomu lokulungiselela, ifomu lokuxhumana elibaluleke kakhulu, ifomu lokuxhumana kanye nefomu lokuxhuma ngokushesha;
30. Izindlela zokubeka i-PCB ze-SMT zifaka: Ukubeka i-vacuum, ukumiswa kwembobo ngomshini, ukubekwa kwe-clamp kabili kanye nokuma konqenqema lwebhodi;
31. Ukumelana nesikrini sikasilika esingu-272 (uphawu) kungu-2700 Ω, futhi uphawu (isikrini sikasilika) sokumelana nenani lokumelana le-4.8m Ω lingu-485;
32. Ukuphrinta kwesikrini sikasilika emzimbeni we-BGA kuhlanganisa nomkhiqizi, inombolo yengxenye yomkhiqizi, indinganiso kanye ne-Datecode / (inombolo yenombolo);
33. Iphimbo lika-208pinqfp lingu-0.5mm;
34. Phakathi kwezindlela eziyisikhombisa ze-QC, umdwebo we-fishbone ugxile ekutholeni ubudlelwano be-causal;
37. I-CPK isho amandla enqubo ngaphansi kokwenziwa kwamanje;
38. I-Flux yaqala ukuphuma endaweni yokushisa engashintshi yokuhlanza amakhemikhali;
39. Ijika elikahle lendawo yokupholisa kanye nejika lezoni ye-reflux yizithombe zesibuko;
40. Ijika le-RSS liyashisisa → izinga lokushisa elingashintshi → i-reflux → ukupholisa;
41. Impahla ye-PCB esiyisebenzisayo i-FR-4;
42. Izinga lekhasi le-PCB le-warpage alidluli u-0.7% we-diagonal yalo;
43. I-laser incision eyenziwe nge-stencil iyindlela engacutshungulwa kabusha;
44. Ububanzi bebhola le-BGA elivame ukusetshenziswa ebhodini elikhulu lekhompyutha ngu-0.76mm;
45. Uhlelo lwe-ABS lunokuxhumana okuhle;
46. Iphutha le-ceramic chip capacitor eca-0105y-k31 ngu-± 10%;
47. I-Panasert Matsushita egcwele i-Mounter esebenzayo ene-voltage engu-3?200 ± 10vac;
48. Ezingxenyeni ze-SMT zokupakisha, ububanzi be-tape reel buyi-intshi engu-13 nama-intshi angu-7;
49. Ukuvulwa kwe-SMT kuvamise ukuba yi-4um encane kunaleyo ye-PCB pad, engagwema ukubonakala kwebhola elimpofu le-solder;
50. Ngokwemithetho yokuhlola ye-PCBA, lapho i-angle ye-dihedral ingaphezu kwama-degree angu-90, ibonisa ukuthi i-solder paste ayinakho ukunamathela kumzimba we-wave solder;
51. Ngemva kokuthi i-IC isivuliwe, uma umswakama osekhadini ungaphezu kuka-30%, kubonisa ukuthi i-IC inomswakama futhi i-hygroscopic;
52. Isilinganiso esilungile sengxenye kanye nesilinganiso sevolumu ye-tin powder ukuze igeleze ku-solder unama yi-90%: 10%, 50%: 50%;
53. Amakhono okuhlanganisa ukubukeka kwasekuqaleni avela emkhakheni wezempi kanye ne-Avionics phakathi nawo-1960;
54. Okuqukethwe kwe-Sn ne-Pb ekunamathiselwe kwe-solder okuvame ukusetshenziswa kakhulu ku-SMT kuhlukile.
Isikhathi sokuthumela: Sep-29-2020