11. Izingxenye ezizwelayo ekucindezelekeni akufanele zibekwe emakhoneni, emaphethelweni, noma eduze nezixhumi, izimbobo ezifakwayo, ama-grooves, ama-cutouts, ama-gashes nasemakhoneni amabhodi esekethe aphrintiwe.Lezi zindawo ziyizindawo zokucindezeleka okuphezulu kwamabhodi wesifunda aphrintiwe, angabangela kalula imifantu noma imifantu emalungeni e-solder nezingxenye.
12. Isakhiwo sezingxenye kufanele sihlangabezane nenqubo kanye nezidingo zesikhala zokuphinda kufakwe i-solder kanye ne-wave soldering.Yehlisa umphumela wethunzi ngesikhathi sokufakwa kwamagagasi.
13. Izimbobo zokubeka ibhodi lesifunda eliphrintiwe kanye nokwesekwa okungaguquki kufanele kubekelwe eceleni ukuze kungene isikhundla.
14. Ekuklanyweni kwendawo enkulu ephrintiwe ibhodi lesifunda elingaphezu kuka-500cm2, ukuze kuvinjwe ibhodi lesifunda eliphrintiwe ukuthi lingagobi lapho liwela isithando somlilo, igebe elingama-5 ~ 10mm ububanzi kufanele lishiywe phakathi kwebhodi lesifunda eliphrintiwe, futhi izingxenye (zingakwazi ukuhamba) akufanele zibekwe, ukuze ukuvimbela ibhodi lesifunda eliphrintiwe ukuthi lingagobi lapho liwela isithando somlilo.
15. Isiqondiso sesakhiwo sengxenye yenqubo ye-reflow soldering.
(1) Isiqondiso sesakhiwo sezingxenye kufanele sicabangele isiqondiso sebhodi lesifunda eliphrintiwe esithandweni somlilo sokugeleza kabusha.
(2) ukuze wenze izingxenye ezimbili ze-chip ezinhlangothini zombili zokuphela kwe-weld kanye nezingxenye ze-SMD ezinhlangothini zombili zokuvumelanisa iphini zishisiwe, ukunciphisa izingxenye ezinhlangothini zombili zokuphela kwe-welding akukhiqizi ukumiswa, ukuguquguquka. , ukushisa okuhambisanayo okuvela kumaphutha okushisela okufana nokuphela kwe-welding ye-solder, kudinga ukuphela kwezingxenye ze-chip ebhodini lesifunda eliphrintiwe i-eksisi ende kufanele ibe yi-perpendicular isiqondiso sebhande lokuthutha le-ovini yokugeleza kabusha.
(3) I-eksisi ende yezingxenye ze-SMD kufanele ihambisane nesiqondisindlela sokudlulisa sesithando somlilo sokugeleza kabusha.I-eksisi ende yezingxenye ze-CHIP kanye ne-eksisi ende yezingxenye ze-SMD kuzo zombili iziphetho kufanele zibe perpendicular komunye nomunye.
(4) Umklamo omuhle wesakhiwo sezingxenye akufanele ucabangele kuphela ukufana kwamandla okushisa, kodwa futhi ucabangele isiqondiso nokulandelana kwezingxenye.
(5) Ukuze kugcinwe usayizi omkhulu webhodi lesifunda eliphrintiwe, ukuze kugcinwe izinga lokushisa ezinhlangothini zombili zebhodi lesifunda eliphrintiwe lingaguquki ngangokunokwenzeka, uhlangothi olude lwebhodi lesifunda eliphrintiwe kufanele luhambisane nesiqondiso sebhande lokudlulisa lokugeleza kabusha. isithando somlilo.Ngakho-ke, lapho usayizi webhodi lesifunda ephrintiwe mkhulu kuno-200mm, izidingo zimi kanje:
(A) i-eksisi ende yengxenye ye-CHIP kuzo zombili iziphetho incike ohlangothini olude lwebhodi lesifunda eliphrintiwe.
(B) I-eksisi ende yengxenye ye-SMD ihambisana nohlangothi olude lwebhodi lesifunda eliphrintiwe.
(C)Ebhodini lesifunda eliphrintiwe elihlanganiswe nhlangothi zombili, izingxenye zombili zinomumo ofanayo.
(D)Hlela indlela yezingxenye ebhodini lesekethe eliphrintiwe.Izingxenye ezifanayo kufanele zihlelwe ngendlela efanayo ngangokunokwenzeka, futhi isiqondiso sesici kufanele sifane, ukuze kube lula ukufakwa, ukushisela nokutholwa kwezingxenye.Uma i-electrolytic capacitor positive pole, i-diode positive pole, i-transistor single pin end, iphinikhodi yokuqala yesiqondisindlela sokuhlelwa kwesekethe edidiyelwe iyahambisana ngangokunokwenzeka.
16. Ukuze uvimbele ukujikeleza okufushane phakathi kwezingqimba ezibangelwa ukuthinta intambo ephrintiwe phakathi nokucubungula i-PCB, iphethini yokuqhuba yesendlalelo sangaphakathi nesendlalelo sangaphandle kufanele sibe ngaphezu kuka-1.25mm ukusuka onqenqemeni lwe-PCB.Uma intambo yaphansi ibekwe onqenqemeni lwe-PCB yangaphandle, ucingo lwaphansi lungahlala endaweni yonqenqema.Ezikhundleni eziphezulu ze-PCB ezihlalwe ngenxa yezidingo zesakhiwo, izingxenye kanye nama-conductor aphrintiwe akufanele abekwe endaweni engaphansi ye-solder pad ye-SMD/SMC ngaphandle kwezimbobo, ukuze kugwenywe ukuphambuka kwe-solder ngemva kokushiswa nokuncibilika kumagagasi. i-soldering ngemuva kwe-reflow soldering.
17. Isikhala sokufakwa kwezingxenye: Isikhala esincane sokufakwa kwezingxenye kufanele sihlangabezane nezimfuneko zokuhlanganisa i-SMT ukuze zenziwe, zihloleke, zigcineke.
Isikhathi sokuthumela: Dec-21-2020