1. I-PCB ayikho unqenqema lwenqubo, izimbobo zokucubungula, ayikwazi ukuhlangabezana nezidingo zokuphoqa imishini ye-SMT, okusho ukuthi ayikwazi ukuhlangabezana nezidingo zokukhiqiza ngobuningi.
2. I-PCB shape alien noma usayizi omkhulu kakhulu, mncane kakhulu, okufanayo akukwazi ukuhlangabezana nezidingo zokuhlanganisa imishini.
3. PCB, FQFP pads azungeze no optical positioning mark (Mark) noma Mark point is not standard, such as Mark point around the solder resist film, noma enkulu kakhulu, encane kakhulu, okuholela Mark point image umehluko kuncane kakhulu, umshini ngokuvamile i-alamu ayikwazi ukusebenza kahle.
4. Usayizi wesakhiwo sephedi awulungile, njengokuthi isikhala sephedi sezingxenye ze-chip sikhulu kakhulu, sincane kakhulu, i-pad ayilingani, okuholela ekulimaleni okuhlukahlukene ngemva kokushiselwa kwezingxenye ze-chip, njengetshe lesikhumbuzo, elimile. .
5. Amaphedi ane-over-hole azobangela ukuthi i-solder incibilike ngembobo iye phansi, kubangele i-solder encane kakhulu.
6. Usayizi wephedi wezingxenye ze-chip awulingani, ikakhulukazi ngomugqa wezwe, ngaphezu komugqa wengxenye yokusetshenziswa njengephedi, ukuzereflow ovenizingxenye ze-soldering chip kuzo zombili iziphetho zephedi lokushisa elingalingani, ukunamathisela kwe-solder kuye kwancibilika futhi kubangelwa ukukhubazeka kwesikhumbuzo.
7. Idizayini yephedi ye-IC ayilungile, i-FQFP kuphedi ibanzi kakhulu, okubangela ibhuloho ngemuva kokushisela ngisho, noma iphedi ngemuva konqenqema lifushane kakhulu okubangelwa amandla anganele ngemuva kokushisela.
8. Amaphedi e-IC phakathi kwezintambo ezixhumanisayo abekwe phakathi nendawo, angahambisani nokuhlolwa kwe-SMA post-soldering.
9. Umshini we-Wave solderingI-IC awekho amaphedi asizayo aklamayo, okuholela ekuvaleni kwebhuloho ngemuva kokudayiswa.
10. Ukujiya kwe-PCB noma i-PCB ekusatshalalisweni kwe-IC akunangqondo, ukuguqulwa kwe-PCB ngemuva kokushisela.
11. Idizayini yephoyinti lokuhlola ayilinganisiwe, ukuze i-ICT ingakwazi ukusebenza.
12. Igebe phakathi kwama-SMD alilungile, futhi kuvela ubunzima ekulungiseni kamuva.
13. Isendlalelo sokumelana ne-solder kanye nemephu yezinhlamvu azifanisiwe, futhi isendlalelo sokumelana ne-solder kanye nemephu yezinhlamvu ziwela kumaphedi okubangela ukunamathisela okungamanga noma ukunqanyulwa kukagesi.
14. ukuklama okungenangqondo kwebhodi lokuhlanganisa, njengokungacutshungulwa kahle kwama-V-slots, okuholela ekuguqukeni kwe-PCB ngemva kokugeleza kabusha.
Amaphutha angenhla angenzeka emkhiqizweni owodwa noma eminingi eklanywe kabi, okuholela emazingeni ahlukene omthelela kukhwalithi ye-solder.Abaqambi abazi ngokwanele mayelana nenqubo ye-SMT, ikakhulukazi izingxenye ze-reflow soldering zinenqubo "eguquguqukayo" engaqondi ukuthi esinye sezizathu zokuklama okubi.Ukwengeza, idizayini isheshe yaziba inqubo yabasebenzi yokubamba iqhaza ekuntulekeni kokucaciswa kwedizayini yebhizinisi yokwenziwa, futhi kuyimbangela yedizayini embi.
Isikhathi sokuthumela: Jan-20-2022