Amaphuzu olwazi angu-110 we-SMT chip processing ingxenye 2
56. Ekuqaleni kwawo-1970, kwakukhona uhlobo olusha lwe-SMD embonini, eyayibizwa ngokuthi "i-sealed foot less chip carrier", eyayivame ukushintshwa yi-HCC;
57. Ukumelana nemojula enophawu 272 kufanele kube ngu-2.7K ohm;
58. Umthamo wemojula engu-100nF uyafana nalowo we-0.10uf;
Iphuzu le-eutectic lika-63Sn + 37Pb lingu-183 ℃;
60. Impahla eluhlaza esetshenziswa kakhulu ye-SMT izitsha zobumba;
61. Izinga lokushisa eliphakeme kakhulu lejika lokushisa lesithando sokugeleza kabusha lingu-215C;
62. Izinga lokushisa lesithando somlilo lingama-245c uma lihlolwa;
63. Ezingxenyeni ze-SMT, ububanzi be-coiling plate ingama-intshi angu-13 nama-intshi angu-7;
64. Uhlobo lokuvula lwensimbi yensimbi luyisikwele, elingunxantathu, luyindilinga, olumise okwenkanyezi futhi lusobala;
65. I-PCB eseceleni yekhompiyutha esetshenziswa njengamanje, impahla yayo eluhlaza yile: ibhodi le-fiber board;
66. Hlobo luni lwepuleti ye-ceramic ye-substrate i-solder paste ye-sn62pb36ag2 ezosetshenziswa;
67. I-Rosin based flux ingahlukaniswa ngezinhlobo ezine: R, RA, RSA kanye ne-RMA;
68. Ukuthi ukumelana kwesigaba se-SMT kuyaqondisa noma cha;
69. I-solder paste yamanje emakethe idinga kuphela amahora angu-4 wesikhathi sokunamathela ekusebenzeni;
70. Umfutho womoya owengeziwe ovame ukusetshenziswa imishini ye-SMT ngu-5kg / cm2;
71. Hlobo luni lwendlela yokushisela okufanele isetshenziswe lapho i-PTH ohlangothini lwangaphambili ingadluli esithandweni somlilo esine-SMT;
72. Izindlela zokuhlola ezijwayelekile ze-SMT: ukuhlolwa okubonakalayo, ukuhlolwa kwe-X-ray nokuhlolwa kombono womshini
73. Indlela yokushisa ukushisa yezingxenye zokulungisa i-ferrochrome i-conduction + convection;
74. Ngokusho kwedatha ye-BGA yamanje, i-sn90 pb10 iyibhola lethini eliyinhloko;
75. Indlela yokukhiqiza yensimbi yensimbi: ukusika i-laser, i-electroforming kanye ne-chemical etching;
76. Izinga lokushisa lesithando somlilo: sebenzisa i-thermometer ukukala izinga lokushisa elisebenzayo;
77. Uma imikhiqizo eseqediwe kancane ye-SMT SMT ithunyelwa kwamanye amazwe, izingxenye zilungiswa ku-PCB;
78. Inqubo yokuphathwa kwekhwalithi yesimanje tqc-tqa-tqm;
79. Ukuhlolwa kwe-ICT ukuhlolwa kombhede inaliti;
80. Ukuhlolwa kwe-ICT kungasetshenziswa ukuhlola izingxenye ze-electronic, futhi ukuhlolwa okumile kukhethwa;
81. Izici ze-solder tin ukuthi indawo yokuncibilika iphansi kunezinye izinsimbi, izakhiwo ezibonakalayo ziyanelisa, futhi uketshezi lungcono kunezinye izinsimbi ekushiseni okuphansi;
82. Ijika lokulinganisa kufanele lilinganiswe kusukela ekuqaleni lapho izimo zenqubo yezingxenye zesithando somlilo zishintshwa;
83. Siemens 80F / S ingeye-electronic control drive;
84. I-gauge ye-solder paste ukujiya isebenzisa ukukhanya kwe-laser ukukala: idigri yokunamathisela ye-solder, ukujiya kokunamathisela kwe-solder nobubanzi bokuphrinta be-solder;
85. Izingxenye ze-SMT zihlinzekwa nge-oscillating feeder, i-disc feeder kanye ne-coiling belt feeder;
86. Yiziphi izinhlangano ezisetshenziswa emishinini ye-SMT: isakhiwo sekhamera, isakhiwo sebha eseceleni, isakhiwo sesikulufu kanye nesakhiwo sokushelela;
87. Uma ingxenye yokuhlola okubukwayo ingabonakali, i-BOM, imvume yomkhiqizi kanye nebhodi lesampula kuyolandelwa;
88. Uma indlela yokupakisha yezingxenye ingu-12w8p, isikali sephinikhodi sekhawunta kufanele silungiswe sibe ngu-8mm isikhathi ngasinye;
89. Izinhlobo zemishini yokushisela: isithando somlilo esishisayo, isithando somlilo se-nitrogen, isithando somlilo se-laser nesithando somlilo se-infrared;
90. Izindlela ezitholakalayo zesivivinyo sesampula sezingxenye ze-SMT: ukukhiqizwa okuvamile, ukukhwezwa komshini wokunyathelisa ngesandla kanye nokufaka isandla sokuphrinta ngesandla;
91. Izimo zamamaki ezivame ukusetshenziswa yilezi: indilinga, isiphambano, isikwele, idayimane, unxantathu, i-Wanzi;
92. Ngenxa yokuthi iphrofayili yokugeleza kabusha ayisethiwe kahle esigabeni se-SMT, indawo yokushisisa kwangaphambili nendawo yokupholisa engenza ukuqhekeka okuncane kwezingxenye;
93. Iziphetho ezimbili zezingxenye ze-SMT zishisiswe ngokulinganayo futhi kulula ukwakha: i-welding engenalutho, ukuphambuka kanye nethebhulethi yamatshe;
94. Izinto zokulungisa izingxenye ze-SMT yilezi: i-soldering iron, i-hot air extractor, isibhamu sethini, ama-tweezers;
95. I-QC ihlukaniswe yaba yi-IQC, IPQC,.I-FQC ne-OQC;
96. IMounter enesivinini esiphezulu ingakhweza i-resistor, i-capacitor, i-IC ne-transistor;
97. Izici zikagesi omile: amandla amancane kanye nethonya elikhulu ngomswakama;
98. Isikhathi somjikelezo womshini onesivinini esikhulu kanye nomshini wendawo yonke kufanele silinganiswe ngokusemandleni;
99. Incazelo yangempela yekhwalithi ukwenza kahle ekuqaleni;
100. Umshini wokubeka kufanele unamathisele izingxenye ezincane kuqala bese kuba izingxenye ezinkulu;
101. I-BIOS iyisistimu yokufaka / yokukhipha eyisisekelo;
102. Izingxenye ze-SMT zingahlukaniswa zibe umthofu futhi zingabi nomthofu ngokuya ngokuthi zikhona yini izinyawo;
103. Kunezinhlobo ezintathu eziyisisekelo zemishini yokubeka esebenzayo: ukubekwa okuqhubekayo, ukubekwa okuqhubekayo kanye nezibekelo eziningi ezinikezela ngesandla;
104. I-SMT ingakhiqizwa ngaphandle kwesilayishi;
105. Inqubo ye-SMT iqukethe uhlelo lokuphakela, iphrinta ye-solder paste, umshini wejubane eliphezulu, umshini wendawo yonke, umshini wokushisela wamanje kanye nomshini wokuqoqa amapuleti;
106. Lapho kuvulwa izingxenye ezizwelayo zokushisa nomswakama, umbala osendingilizini yekhadi lomswakama uba luhlaza okwesibhakabhaka, futhi izingxenye zingasetshenziswa;
107. Izinga lobukhulu lika-20 mm akubona ububanzi bomugqa;
108. Izimbangela zesekethe emfishane ngenxa yokungaphrinteki kahle kule nqubo:
a.Uma okuqukethwe kwensimbi kokunamathisela kwe-solder kungalungile, kuzodala ukuwa
b.Uma ukuvulwa kwepuleti lensimbi kukhulu kakhulu, okuqukethwe kwethini kuningi kakhulu
c.Uma ikhwalithi yensimbi yensimbi impofu futhi ithini impofu, shintsha ithempulethi yokusika i-laser
D. kukhona unamathisele we-solder oyinsalela ohlangothini olungemuva lwe-stencil, yehlisa ingcindezi ye-scraper, bese ukhetha i-vaccum ne-solvent efanele.
109. Inhloso yobunjiniyela eyinhloko yezoni ngayinye yephrofayela yesithando somlilo sokugeleza kabusha imi kanje:
a.Preheat zone;inhloso yobunjiniyela: ukuguquguquka kokushintshashintsha kokunamathisela kwe-solder.
b.Indawo yokulinganisa izinga lokushisa;inhloso yobunjiniyela: ukusebenza kwe-flux ukususa ama-oxide;ukuphuma komswakama osele.
c.Indawo yokugeleza kabusha;inhloso yobunjiniyela: ukuncibilika kwe-solder.
d.Indawo yokupholisa;inhloso yobunjiniyela: ukwakheka okuhlangene kwe-alloy solder, ingxenye yonyawo kanye nephedi iyonke;
110. Enqubweni ye-SMT SMT, izimbangela eziyinhloko zobuhlalu be-solder yilezi: ukuvezwa okungalungile kwephedi ye-PCB, ukuboniswa okubi kokuvuleka kwepuleti lensimbi, ukujula okweqile noma ingcindezi yokubeka, umthambeka omkhulu kakhulu okhuphukayo wejika lephrofayela, ukuwa kwe-solder paste kanye ne-viscosity yokunamathisela ephansi. .
Isikhathi sokuthumela: Sep-29-2020